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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1934-T-H

APH-1934-T-H

APH-1934-T-H

Samtec Inc.

0 -
APH-1934-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1534-T-H

APH-1534-T-H

APH-1534-T-H

Samtec Inc.

0 -
APH-1534-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0434-T-H

APH-0434-T-H

APH-0434-T-H

Samtec Inc.

0 -
APH-0434-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1234-T-H

APH-1234-T-H

APH-1234-T-H

Samtec Inc.

0 -
APH-1234-T-H

数据表

* - Active - - - - - - - - - - - - - - -
116-93-310-61-003000

116-93-310-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-310-61-003000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
121-11-640-41-001000

121-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-640-41-001000

数据表

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
40-0501-21

40-0501-21

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0 -
40-0501-21

数据表

501 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
40-0501-31

40-0501-31

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0 -
40-0501-31

数据表

501 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
123-43-328-41-801000

123-43-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-43-328-41-801000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-93-328-41-801000

123-93-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-93-328-41-801000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
44-6571-10

44-6571-10

CONN IC DIP SOCKET ZIF 44POS TIN

Aries Electronics

0 -
44-6571-10

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
612-11-432-41-001000

612-11-432-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-432-41-001000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) - - Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
612-11-632-41-001000

612-11-632-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-11-632-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) - - Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
APO-422-G-C

APO-422-G-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-422-G-C

数据表

APO Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
514-87-321-19-121154

514-87-321-19-121154

CONN SOCKET PGA 321POS GOLD

Preci-Dip

0 -
514-87-321-19-121154

数据表

514 Bulk Active PGA 321 (19 x 19) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-41-650-31-018000

614-41-650-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-650-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-650-31-018000

614-91-650-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-650-31-018000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0918-G-H

APH-0918-G-H

APH-0918-G-H

Samtec Inc.

0 -
APH-0918-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1418-G-H

APH-1418-G-H

APH-1418-G-H

Samtec Inc.

0 -
APH-1418-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1918-G-H

APH-1918-G-H

APH-1918-G-H

Samtec Inc.

0 -
APH-1918-G-H

数据表

* - Active - - - - - - - - - - - - - - -
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