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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
24-6508-211

24-6508-211

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6508-211

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
24-6508-311

24-6508-311

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6508-311

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
116-43-210-61-003000

116-43-210-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-210-61-003000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-210-61-003000

116-93-210-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-210-61-003000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-6503-31

28-6503-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
APA-422-G-M

APA-422-G-M

ADAPTER PLUG

Samtec Inc.

0 -
APA-422-G-M

数据表

APA Bulk Active - 22 (2 x 11) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
APH-1836-T-T

APH-1836-T-T

APH-1836-T-T

Samtec Inc.

0 -
APH-1836-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1436-T-T

APH-1436-T-T

APH-1436-T-T

Samtec Inc.

0 -
APH-1436-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1636-T-T

APH-1636-T-T

APH-1636-T-T

Samtec Inc.

0 -
APH-1636-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0836-T-T

APH-0836-T-T

APH-0836-T-T

Samtec Inc.

0 -
APH-0836-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1736-T-T

APH-1736-T-T

APH-1736-T-T

Samtec Inc.

0 -
APH-1736-T-T

数据表

* - Active - - - - - - - - - - - - - - -
116-93-636-41-001000

116-93-636-41-001000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-636-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-636-41-001000

116-43-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-636-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
169-PGM13001-10

169-PGM13001-10

CONN SOCKET PGA GOLD 169POS

Aries Electronics

0 -
169-PGM13001-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-99-428-61-001000

110-99-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-428-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-13-322-41-801000

122-13-322-41-801000

CONN IC DIP SOCKET 22POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-322-41-801000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
614-41-652-31-012000

614-41-652-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-652-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-652-31-012000

614-91-652-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-652-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
145-PGM15023-10

145-PGM15023-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
145-PGM15023-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
145-PGM15024-10

145-PGM15024-10

CONN SOCKET PGA GOLD

Aries Electronics

0 -
145-PGM15024-10

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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