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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
1-2199298-2

1-2199298-2

CONN IC DIP SOCKET 8POS TIN

TE Connectivity AMP Connectors

9,722 -
1-2199298-2

数据表

Diplomate DL Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass, Copper
A 14-LC-TT

A 14-LC-TT

CONN IC DIP SOCKET 14POS TIN

Assmann WSW Components

15,964 -
A 14-LC-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
ED281DT

ED281DT

CONN IC DIP SOCKET 28POS TIN

On Shore Technology Inc.

4,058 -
ED281DT

数据表

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
SA083040

SA083040

CONN IC DIP SOCKET 8POS GOLD

On Shore Technology Inc.

1,301 -
SA083040

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Thermoplastic, Polyester, Glass Filled 80.0µin (2.03µm) Brass
110-87-308-41-001101

110-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

20,714 -
110-87-308-41-001101

数据表

110 Box Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 08-HZL-TT

AR 08-HZL-TT

CONN IC DIP SOCKET 8POS TIN

Assmann WSW Components

20,914 -
AR 08-HZL-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
4808-3004-CP

4808-3004-CP

CONN IC DIP SOCKET 8POS TIN

3M

37,370 -
4808-3004-CP

数据表

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
A 40-LC-TT

A 40-LC-TT

CONN IC DIP SOCKET 40POS TIN

Assmann WSW Components

1,066 -
A 40-LC-TT

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
110-44-308-41-001000

110-44-308-41-001000

CONN IC DIP SOCKET 8POS TIN

Mill-Max Manufacturing Corp.

4,620 -
110-44-308-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
SA143000

SA143000

CONN IC DIP SOCKET 14POS GOLD

On Shore Technology Inc.

2,371 -
SA143000

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
SA163000

SA163000

CONN IC DIP SOCKET 16POS GOLD

On Shore Technology Inc.

2,514 -
SA163000

数据表

SA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
DILB40P-223TLF

DILB40P-223TLF

CONN IC DIP SOCKET 40POS TIN

Amphenol ICC (FCI)

6,719 -
DILB40P-223TLF

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 100.0µin (2.54µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA), Nylon 100.0µin (2.54µm) Copper Alloy
AR 16-HZL-TT

AR 16-HZL-TT

CONN IC DIP SOCKET 16POS TIN

Assmann WSW Components

3,453 -
AR 16-HZL-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
110-43-308-41-001000

110-43-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

14,042 -
110-43-308-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-308-41-001000

110-93-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

2,161 -
110-93-308-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
A-CCS 032-Z-SM

A-CCS 032-Z-SM

IC PLCC SOCKET 32POS TIN SMD

Assmann WSW Components

766 -
A-CCS 032-Z-SM

数据表

- Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 160.0µin (4.06µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polyamide (PA9T), Nylon 9T, Glass Filled 160.0µin (4.06µm) Phosphor Bronze
110-99-316-41-001000

110-99-316-41-001000

CONN IC DIP SOCKET 16POS TINLEAD

Mill-Max Manufacturing Corp.

1,423 -
110-99-316-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-87-308-41-105191

110-87-308-41-105191

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

3,488 -
110-87-308-41-105191

数据表

110 Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1050281001

1050281001

CONN CAM SOCKET 32POS GOLD

Molex

14,741 -
1050281001

数据表

105028 Tape & Reel (TR) Active Camera Socket 32 (4 x 8) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame 0.035" (0.90mm) Solder 0.035" (0.90mm) - Nickel Thermoplastic 50.0µin (1.27µm) Copper Alloy
69802-432LF

69802-432LF

CONN SOCKET PLCC 32POS TIN

Amphenol ICC (FCI)

209 -
69802-432LF

数据表

- Tape & Reel (TR) Active PLCC 32 (2 x 7, 2 x 9) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Phosphor Bronze
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