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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
415-93-272-41-003000

415-93-272-41-003000

SOCKET DUAL INLINE LOW PRO 72POS

Mill-Max Manufacturing Corp.

0 -
415-93-272-41-003000

数据表

415 Tube Active DIP, 0.1" (2.54mm) Row Spacing 72 (2 x 36) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-318-61-001000

110-91-318-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-318-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-1202-G-12

HLS-1202-G-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-1202-G-12

数据表

HLS Bulk Active SIP 24 (12 x 2) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
24-6556-21

24-6556-21

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6556-21

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
24-6556-31

24-6556-31

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6556-31

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
110-13-310-61-001000

110-13-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-310-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
126-41-642-41-002000

126-41-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-642-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-642-41-002000

126-91-642-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-642-41-002000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-652-41-003000

116-93-652-41-003000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-652-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-652-41-003000

116-43-652-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-652-41-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-648-NGG

ICO-648-NGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-648-NGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
HLS-0813-TT-2

HLS-0813-TT-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0813-TT-2

数据表

HLS Bulk Active SIP 104 (8 x 13) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
116-41-964-41-006000

116-41-964-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-41-964-41-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-91-964-41-006000

116-91-964-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-91-964-41-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-650-31-012000

614-41-650-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-650-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-650-31-012000

614-91-650-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-650-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-13-636-41-780000

104-13-636-41-780000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.

0 -
104-13-636-41-780000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
116-93-310-61-006000

116-93-310-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-310-61-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-310-61-105000

110-43-310-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-310-61-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-648-41-007000

116-93-648-41-007000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-648-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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