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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-43-648-41-007000

116-43-648-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-648-41-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-41-950-11-480000

605-41-950-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-41-950-11-480000

数据表

605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-91-950-11-480000

605-91-950-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-91-950-11-480000

数据表

605 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-640-ZWGG

ICA-640-ZWGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-ZWGG

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
110-99-322-61-001000

110-99-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-322-61-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-99-422-61-001000

110-99-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-422-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0607-T-10

HLS-0607-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0607-T-10

数据表

HLS Bulk Active SIP 42 (6 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
115-44-320-61-003000

115-44-320-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-320-61-003000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-83-124-13-041112

614-83-124-13-041112

CONN SOCKET PGA 124POS GOLD

Preci-Dip

0 -
614-83-124-13-041112

数据表

614 Bulk Active PGA 124 (13 x 13) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-41-650-31-002000

614-41-650-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-650-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-650-31-002000

614-91-650-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-650-31-002000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-83-149-15-063135

546-83-149-15-063135

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0 -
546-83-149-15-063135

数据表

546 Bulk Active PGA 149 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
546-83-149-15-063136

546-83-149-15-063136

CONN SOCKET PGA 149POS GOLD

Preci-Dip

0 -
546-83-149-15-063136

数据表

546 Bulk Active PGA 149 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
APA-320-G-Q

APA-320-G-Q

ADAPTER PLUG

Samtec Inc.

0 -
APA-320-G-Q

数据表

APA Tube Active - 20 (2 x 10) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
614-41-650-31-007000

614-41-650-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-650-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-650-31-007000

614-91-650-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-650-31-007000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
8058-1G19

8058-1G19

CONN TRANSIST TO-5 8POS GOLD

TE Connectivity AMP Connectors

0 -
8058-1G19

数据表

8058 Bulk Obsolete Transistor, TO-5 8 (Round) Gold - Beryllium Copper Panel Mount - - Solder Cup - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Brass
126-93-642-41-001000

126-93-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
126-93-642-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-642-41-001000

126-43-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-43-642-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-420-61-001000

110-91-420-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-420-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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