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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0518-G-H

APH-0518-G-H

APH-0518-G-H

Samtec Inc.

0 -
APH-0518-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0618-G-H

APH-0618-G-H

APH-0618-G-H

Samtec Inc.

0 -
APH-0618-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1118-G-H

APH-1118-G-H

APH-1118-G-H

Samtec Inc.

0 -
APH-1118-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1618-G-H

APH-1618-G-H

APH-1618-G-H

Samtec Inc.

0 -
APH-1618-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1218-G-H

APH-1218-G-H

APH-1218-G-H

Samtec Inc.

0 -
APH-1218-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1318-G-H

APH-1318-G-H

APH-1318-G-H

Samtec Inc.

0 -
APH-1318-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0418-G-H

APH-0418-G-H

APH-0418-G-H

Samtec Inc.

0 -
APH-0418-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0318-G-H

APH-0318-G-H

APH-0318-G-H

Samtec Inc.

0 -
APH-0318-G-H

数据表

* - Active - - - - - - - - - - - - - - -
116-47-648-41-001000

116-47-648-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
116-47-648-41-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
321-13-132-41-001000

321-13-132-41-001000

SOCKET 1 LEVEL WRAPOST SIP 32POS

Mill-Max Manufacturing Corp.

0 -
321-13-132-41-001000

数据表

321 Tube Active SIP 32 (1 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
614-41-950-31-012000

614-41-950-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-950-31-012000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-950-31-012000

614-91-950-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-950-31-012000

数据表

614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
64-9518-11H

64-9518-11H

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

0 -
64-9518-11H

数据表

518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
110-93-314-61-801000

110-93-314-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-314-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-11-652-41-770000

104-11-652-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-652-41-770000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
116-43-306-61-001000

116-43-306-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-306-61-001000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-44-624-61-003000

115-44-624-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-44-624-61-003000

数据表

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
24-3508-211

24-3508-211

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3508-211

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
24-3508-311

24-3508-311

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3508-311

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
240-4846-00-3303

240-4846-00-3303

CONN IC DIP SOCKET ZIF 40POS GLD

3M

0 -
240-4846-00-3303

数据表

OEM Bulk Obsolete DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 250.0µin (6.35µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyether Imide (PEI), Glass Filled 250.0µin (6.35µm) Beryllium Copper
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