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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APA-632-G-N

APA-632-G-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-632-G-N

数据表

APA Tube Active - 32 (2 x 16) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
110-93-308-61-605000

110-93-308-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-93-308-61-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
50-9503-20

50-9503-20

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

0 -
50-9503-20

数据表

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
50-9503-30

50-9503-30

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

0 -
50-9503-30

数据表

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
126-41-650-41-001000

126-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-41-650-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-650-41-001000

126-91-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
126-91-650-41-001000

数据表

126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-93-642-41-001000

123-93-642-41-001000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-93-642-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-43-642-41-001000

123-43-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-43-642-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-640-41-001000

614-93-640-41-001000

SOCKET CARRIER LOWPRO .600 40POS

Mill-Max Manufacturing Corp.

0 -
614-93-640-41-001000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-43-640-41-001000

614-43-640-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-43-640-41-001000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-950-41-006000

116-93-950-41-006000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

0 -
116-93-950-41-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-950-41-006000

116-43-950-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-950-41-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-83-280-18-101111

517-83-280-18-101111

CONN SOCKET PGA 280POS GOLD

Preci-Dip

0 -
517-83-280-18-101111

数据表

517 Bulk Active PGA 280 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-1414-G-H

APH-1414-G-H

APH-1414-G-H

Samtec Inc.

0 -
APH-1414-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0514-G-H

APH-0514-G-H

APH-0514-G-H

Samtec Inc.

0 -
APH-0514-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0614-G-H

APH-0614-G-H

APH-0614-G-H

Samtec Inc.

0 -
APH-0614-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0714-G-H

APH-0714-G-H

APH-0714-G-H

Samtec Inc.

0 -
APH-0714-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1614-G-H

APH-1614-G-H

APH-1614-G-H

Samtec Inc.

0 -
APH-1614-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0314-G-H

APH-0314-G-H

APH-0314-G-H

Samtec Inc.

0 -
APH-0314-G-H

数据表

* - Active - - - - - - - - - - - - - - -
122-13-318-41-801000

122-13-318-41-801000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-318-41-801000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
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