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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
123-91-650-41-001000

123-91-650-41-001000

SOCKET IC OPEN 3 LVL .600 50POS

Mill-Max Manufacturing Corp.

0 -
123-91-650-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-41-650-41-001000

123-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-41-650-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-13-328-41-001000

612-13-328-41-001000

SOCKET CARRIER SLDRTL .300 28POS

Mill-Max Manufacturing Corp.

0 -
612-13-328-41-001000

数据表

612 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
612-13-428-41-001000

612-13-428-41-001000

SOCKET CARRIER SLDRTL .400 28POS

Mill-Max Manufacturing Corp.

0 -
612-13-428-41-001000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
612-13-628-41-001000

612-13-628-41-001000

SOCKET CARRIER SLDRTL .600 28POS

Mill-Max Manufacturing Corp.

0 -
612-13-628-41-001000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
116-43-210-61-006000

116-43-210-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-210-61-006000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-210-61-006000

116-93-210-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-210-61-006000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
64-9518-10TE

64-9518-10TE

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics

0 -
64-9518-10TE

数据表

518 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
612-43-432-41-004000

612-43-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-432-41-004000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-43-632-41-004000

612-43-632-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-43-632-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-93-432-41-004000

612-93-432-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-432-41-004000

数据表

612 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-93-632-41-004000

612-93-632-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-93-632-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-41-648-41-001000

614-41-648-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-41-648-41-001000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-91-648-41-001000

614-91-648-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

0 -
614-91-648-41-001000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-41-636-41-004000

612-41-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-636-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-636-41-004000

612-91-636-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-636-41-004000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-41-652-11-480000

605-41-652-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-41-652-11-480000

数据表

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
605-91-652-11-480000

605-91-652-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.

0 -
605-91-652-11-480000

数据表

605 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1834-T-H

APH-1834-T-H

APH-1834-T-H

Samtec Inc.

0 -
APH-1834-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0534-T-H

APH-0534-T-H

APH-0534-T-H

Samtec Inc.

0 -
APH-0534-T-H

数据表

* - Active - - - - - - - - - - - - - - -
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