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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
324-13-120-41-002000

324-13-120-41-002000

CONN SOCKET SIP 20POS GOLD

Mill-Max Manufacturing Corp.

0 -
324-13-120-41-002000

数据表

324 Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
122-13-328-41-001000

122-13-328-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-328-41-001000

数据表

122 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
122-13-428-41-001000

122-13-428-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-428-41-001000

数据表

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
122-13-628-41-001000

122-13-628-41-001000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-628-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
116-93-306-61-007000

116-93-306-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-306-61-007000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-11-432-41-001000

122-11-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-432-41-001000

数据表

122 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
122-11-632-41-001000

122-11-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-632-41-001000

数据表

122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
HLS-0320-T-15

HLS-0320-T-15

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0320-T-15

数据表

HLS Tube Active SIP 60 (3 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
268-5401-00-1102JH

268-5401-00-1102JH

CONN SOCKET CLCC 68POS GOLD

3M

0 -
268-5401-00-1102JH

数据表

OEM Tray Obsolete CLCC 68 (4 x 17) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyphenylene Sulfide (PPS), Glass Filled 30.0µin (0.76µm) Beryllium Copper
510-41-101-13-061001

510-41-101-13-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-41-101-13-061001

数据表

510 Bulk Active PGA 101 (13 x 13) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
HLS-0220-G-10

HLS-0220-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0220-G-10

数据表

HLS Tube Active SIP 40 (2 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
121-11-636-41-001000

121-11-636-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
121-11-636-41-001000

数据表

121 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
110-99-424-61-001000

110-99-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-99-424-61-001000

数据表

110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-11-650-41-770000

104-11-650-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
104-11-650-41-770000

数据表

104 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
123-11-328-41-001000

123-11-328-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-328-41-001000

数据表

123 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
123-11-428-41-001000

123-11-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-428-41-001000

数据表

123 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
123-11-628-41-001000

123-11-628-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-628-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
612-41-642-41-003000

612-41-642-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-41-642-41-003000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-91-642-41-003000

612-91-642-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

0 -
612-91-642-41-003000

数据表

612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
123-47-652-41-001000

123-47-652-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
123-47-652-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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