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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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324-13-120-41-002000CONN SOCKET SIP 20POS GOLD |
0 | - |
|
数据表 |
324 | Tube | Active | SIP | 20 (1 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
122-13-328-41-001000CONN IC DIP SOCKET 28POS GOLD |
0 | - |
|
数据表 |
122 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
122-13-428-41-001000CONN IC DIP SOCKET 28POS GOLD |
0 | - |
|
数据表 |
122 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
122-13-628-41-001000CONN IC DIP SOCKET 28POS GOLD |
0 | - |
|
数据表 |
122 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
116-93-306-61-007000CONN IC SKT DBL |
0 | - |
|
数据表 |
116 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
122-11-432-41-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
122 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
122-11-632-41-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
122 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
HLS-0320-T-15.100" SCREW MACHINE SOCKET ARRAY |
0 | - |
|
数据表 |
HLS | Tube | Active | SIP | 60 (3 x 20) | Tin | - | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | - | Thermoplastic | - | - |
|
268-5401-00-1102JHCONN SOCKET CLCC 68POS GOLD |
0 | - |
|
数据表 |
OEM | Tray | Obsolete | CLCC | 68 (4 x 17) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
510-41-101-13-061001SKT PGA SOLDRTL |
0 | - |
|
数据表 |
510 | Bulk | Active | PGA | 101 (13 x 13) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
HLS-0220-G-10.100" SCREW MACHINE SOCKET ARRAY |
0 | - |
|
数据表 |
HLS | Tube | Active | SIP | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
121-11-636-41-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
121 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
110-99-424-61-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
104-11-650-41-770000CONN IC SKT DBL |
0 | - |
|
数据表 |
104 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
123-11-328-41-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
123 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
123-11-428-41-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
123 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 28 (2 x 14) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
123-11-628-41-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
123 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | - | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Brass Alloy |
|
612-41-642-41-003000SKT CARRIER SOLDRTL |
0 | - |
|
数据表 |
612 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
612-91-642-41-003000SKT CARRIER SOLDRTL |
0 | - |
|
数据表 |
612 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
123-47-652-41-001000STANDRD SOLDRTL |
0 | - |
|
数据表 |
123 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 52 (2 x 26) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
