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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
24-6518-01

24-6518-01

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6518-01

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-81250-610C

16-81250-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-81250-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8300-610C

16-8300-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8300-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8350-610C

16-8350-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8350-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8400-610C

16-8400-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8400-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8540-610C

16-8540-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8540-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8625-610C

16-8625-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8625-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8700-610C

16-8700-610C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8700-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
510-83-175-15-061101

510-83-175-15-061101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
510-83-175-15-061101

数据表

510 Bulk Active PGA 175 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-175-16-001101

510-83-175-16-001101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
510-83-175-16-001101

数据表

510 Bulk Active PGA 175 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-175-16-071101

510-83-175-16-071101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
510-83-175-16-071101

数据表

510 Bulk Active PGA 175 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-175-16-072101

510-83-175-16-072101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
510-83-175-16-072101

数据表

510 Bulk Active PGA 175 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-175-14-001101

510-83-175-14-001101

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
510-83-175-14-001101

数据表

510 Bulk Active PGA 175 (14 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0409-S-2

HLS-0409-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0409-S-2

数据表

HLS Bulk Active SIP 36 (4 x 9) Gold - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
ICO-324-ZAGG

ICO-324-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-324-ZAGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICO-624-ZAGG

ICO-624-ZAGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-624-ZAGG

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
HLS-0406-T-10

HLS-0406-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0406-T-10

数据表

HLS Bulk Active SIP 24 (4 x 6) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
17-0501-20

17-0501-20

CONN SOCKET SIP 17POS TIN

Aries Electronics

0 -
17-0501-20

数据表

501 Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
18-6820-90C

18-6820-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
18-6822-90C

18-6822-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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