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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
18-6823-90C

18-6823-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-6823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-822-90C

20-822-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-823-90C

20-823-90C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
299-83-630-10-002101

299-83-630-10-002101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip

0 -
299-83-630-10-002101

数据表

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 30 (2 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
40-0518-00

40-0518-00

CONN SOCKET SIP 40POS GOLD

Aries Electronics

0 -
40-0518-00

数据表

518 Bulk Active SIP 40 (1 x 40) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
40-1518-00

40-1518-00

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
XR2A-6411-N

XR2A-6411-N

I.C. CONNECTOR SOCKET

Omron Electronics Inc-EMC Div

0 -
XR2A-6411-N

数据表

* Bulk Active - - - - - - - - - - - - - - -
14-8240-310C

14-8240-310C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-8240-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
110-13-964-41-001000

110-13-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
110-13-964-41-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
299-87-636-10-002101

299-87-636-10-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
299-87-636-10-002101

数据表

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-176-15-061101

510-83-176-15-061101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

0 -
510-83-176-15-061101

数据表

510 Bulk Active PGA 176 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-176-16-001101

510-83-176-16-001101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

0 -
510-83-176-16-001101

数据表

510 Bulk Active PGA 176 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-176-16-071101

510-83-176-16-071101

CONN SOCKET PGA 176POS GOLD

Preci-Dip

0 -
510-83-176-16-071101

数据表

510 Bulk Active PGA 176 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICO-640-ATT

ICO-640-ATT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-640-ATT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
APH-1414-T-H

APH-1414-T-H

APH-1414-T-H

Samtec Inc.

0 -
APH-1414-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0514-T-H

APH-0514-T-H

APH-0514-T-H

Samtec Inc.

0 -
APH-0514-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1914-T-H

APH-1914-T-H

APH-1914-T-H

Samtec Inc.

0 -
APH-1914-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1114-T-H

APH-1114-T-H

APH-1114-T-H

Samtec Inc.

0 -
APH-1114-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0214-T-H

APH-0214-T-H

APH-0214-T-H

Samtec Inc.

0 -
APH-0214-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0814-T-H

APH-0814-T-H

APH-0814-T-H

Samtec Inc.

0 -
APH-0814-T-H

数据表

* - Active - - - - - - - - - - - - - - -
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