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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
16-8720-310C

16-8720-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8720-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8750-310C

16-8750-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8750-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8800-310C

16-8800-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8800-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8810-310C

16-8810-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8810-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8850-310C

16-8850-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8850-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
16-8990-310C

16-8990-310C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-8990-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
HLS-0310-T-11

HLS-0310-T-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0310-T-11

数据表

HLS Tube Active SIP 30 (3 x 10) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
HLS-0406-T-2

HLS-0406-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0406-T-2

数据表

HLS Bulk Active SIP 24 (4 x 6) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
117-93-664-41-005000

117-93-664-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
117-93-664-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-640-WTT-2

ICA-640-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-640-WTT-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
3-1825046-0

3-1825046-0

CONN IC DIP SOCKET 32POS GOLD

TE Connectivity AMP Connectors

0 -
3-1825046-0

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - - - - Brass
ICA-648-WTT-2

ICA-648-WTT-2

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-WTT-2

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
ICO-632-ZMGT

ICO-632-ZMGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-632-ZMGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
510-83-172-16-001101

510-83-172-16-001101

CONN SOCKET PGA 172POS GOLD

Preci-Dip

0 -
510-83-172-16-001101

数据表

510 Bulk Active PGA 172 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-156-15-061101

510-83-156-15-061101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

0 -
510-83-156-15-061101

数据表

510 Bulk Active PGA 156 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-156-15-062101

510-83-156-15-062101

CONN SOCKET PGA 156POS GOLD

Preci-Dip

0 -
510-83-156-15-062101

数据表

510 Bulk Active PGA 156 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0218-T-22

HLS-0218-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0218-T-22

数据表

HLS Tube Active SIP 36 (2 x 18) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
14-0508-21

14-0508-21

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0508-21

数据表

508 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
14-0508-31

14-0508-31

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0508-31

数据表

508 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
27-0508-20

27-0508-20

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
27-0508-20

数据表

508 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
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