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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
ICA-320-AGG

ICA-320-AGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-AGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
ICO-320-AGG

ICO-320-AGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-320-AGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
510-83-179-18-001101

510-83-179-18-001101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

0 -
510-83-179-18-001101

数据表

510 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-179-18-111101

510-83-179-18-111101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

0 -
510-83-179-18-111101

数据表

510 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-179-18-112101

510-83-179-18-112101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

0 -
510-83-179-18-112101

数据表

510 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-179-18-113101

510-83-179-18-113101

CONN SOCKET PGA 179POS GOLD

Preci-Dip

0 -
510-83-179-18-113101

数据表

510 Bulk Active PGA 179 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-174-17-061101

510-83-174-17-061101

CONN SOCKET PGA 174POS GOLD

Preci-Dip

0 -
510-83-174-17-061101

数据表

510 Bulk Active PGA 174 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-174-17-081101

510-83-174-17-081101

CONN SOCKET PGA 174POS GOLD

Preci-Dip

0 -
510-83-174-17-081101

数据表

510 Bulk Active PGA 174 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
10-3503-21

10-3503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-3503-21

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
10-3503-31

10-3503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-3503-31

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
HLS-0120-G-30

HLS-0120-G-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0120-G-30

数据表

HLS Tube Active SIP 20 (1 x 20) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
510-83-155-16-093101

510-83-155-16-093101

CONN SOCKET PGA 155POS GOLD

Preci-Dip

0 -
510-83-155-16-093101

数据表

510 Bulk Active PGA 155 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-324-ZSGG

ICA-324-ZSGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-324-ZSGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
1437504-3

1437504-3

CONN TRANSIST TO-5 4POS GOLD

TE Connectivity AMP Connectors

0 -
1437504-3

数据表

8060 Bulk Obsolete Transistor, TO-5 4 (Round) Gold - Beryllium Copper Through Hole Closed Frame - Solder - -55°C ~ 125°C Gold Polytetrafluoroethylene (PTFE) - Beryllium Copper
HLS-0112-G-3

HLS-0112-G-3

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0112-G-3

数据表

HLS Tube Active SIP 12 (1 x 12) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
20-4518-10E

20-4518-10E

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4518-10E

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
12-81250-310C

12-81250-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-81250-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
12-8590-310C

12-8590-310C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-8590-310C

数据表

8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
714-43-128-31-018000

714-43-128-31-018000

CONN SOCKET SIP 28POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-128-31-018000

数据表

714 Bulk Active SIP 28 (1 x 28) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
APH-1818-T-H

APH-1818-T-H

APH-1818-T-H

Samtec Inc.

0 -
APH-1818-T-H

数据表

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