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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
ICA-648-WTT

ICA-648-WTT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-648-WTT

数据表

ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
ICO-648-SGT

ICO-648-SGT

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-648-SGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
510-83-182-18-091101

510-83-182-18-091101

CONN SOCKET PGA 182POS GOLD

Preci-Dip

0 -
510-83-182-18-091101

数据表

510 Bulk Active PGA 182 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
12-6810-90WR

12-6810-90WR

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-6810-90WR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
ICO-322-CGG

ICO-322-CGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-322-CGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
24-6518-10E

24-6518-10E

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6518-10E

数据表

518 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICF-648-FM-I

ICF-648-FM-I

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-648-FM-I

数据表

ICF Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 3.00µin (0.076µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
510-83-177-15-061101

510-83-177-15-061101

CONN SOCKET PGA 177POS GOLD

Preci-Dip

0 -
510-83-177-15-061101

数据表

510 Bulk Active PGA 177 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICA-320-ZHGT

ICA-320-ZHGT

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-320-ZHGT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
HLS-0118-G-10

HLS-0118-G-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0118-G-10

数据表

HLS Tube Active SIP 18 (1 x 18) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
10-6503-21

10-6503-21

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-6503-21

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
10-6503-31

10-6503-31

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-6503-31

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
42-6513-11H

42-6513-11H

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

0 -
42-6513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
20-820-90

20-820-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-820-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
20-820-90TWR

20-820-90TWR

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

0 -
20-820-90TWR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
20-822-90

20-822-90

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-822-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
24-6823-90T

24-6823-90T

CONN IC DIP SOCKET 24POS TIN

Aries Electronics

0 -
24-6823-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
20-810-90T

20-810-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

0 -
20-810-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
22-4820-90C

22-4820-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
22-6822-90C

22-6822-90C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-6822-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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