富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
27-0508-30

27-0508-30

CONN SOCKET SIP 27POS GOLD

Aries Electronics

0 -
27-0508-30

数据表

508 Bulk Active SIP 27 (1 x 27) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
20-3508-201

20-3508-201

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3508-201

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-3508-301

20-3508-301

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3508-301

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
21-0508-30

21-0508-30

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0508-30

数据表

508 Bulk Active SIP 21 (1 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
APO-624-T-R

APO-624-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-624-T-R

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
APO-324-T-R

APO-324-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-324-T-R

数据表

APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
24-3503-20

24-3503-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3503-20

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
14-1508-21

14-1508-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-1508-21

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
14-1508-31

14-1508-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-1508-31

数据表

508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Brass
116-83-650-41-011101

116-83-650-41-011101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
116-83-650-41-011101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
11-0501-20

11-0501-20

CONN SOCKET SIP 11POS TIN

Aries Electronics

0 -
11-0501-20

数据表

501 Bulk Active SIP 11 (1 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
11-0501-30

11-0501-30

CONN SOCKET SIP 11POS TIN

Aries Electronics

0 -
11-0501-30

数据表

501 Bulk Active SIP 11 (1 x 11) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
22-4518-01

22-4518-01

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

0 -
22-4518-01

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0309-T-10

HLS-0309-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0309-T-10

数据表

HLS Tube Active SIP 27 (3 x 9) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
ICA-316-ZWGG

ICA-316-ZWGG

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-316-ZWGG

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
HLS-0404-G-2

HLS-0404-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0404-G-2

数据表

HLS Bulk Active SIP 16 (4 x 4) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
HLS-0408-T-2

HLS-0408-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0408-T-2

数据表

HLS Bulk Active SIP 32 (4 x 8) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
10-6621-30

10-6621-30

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

0 -
10-6621-30

数据表

6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
24-3518-11H

24-3518-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-3518-11H

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
28-6501-30

28-6501-30

CONN IC DIP SOCKET 28POS TIN

Aries Electronics

0 -
28-6501-30

数据表

501 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户