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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
1-1571552-2

1-1571552-2

CONN IC DIP SOCKET 40POS TIN

TE Connectivity AMP Connectors

0 -
1-1571552-2

数据表

800 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Copper
40-6575-11

40-6575-11

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

0 -
40-6575-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
13-0513-11H

13-0513-11H

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0513-11H

数据表

0513 Bulk Active SIP 13 (1 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
116-83-420-41-009101

116-83-420-41-009101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-420-41-009101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
558-10-192M16-001101

558-10-192M16-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip

0 -
558-10-192M16-001101

数据表

558 Bulk Active PGA 192 (16 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
ICA-314-ZSST

ICA-314-ZSST

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-314-ZSST

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled - Brass
326-93-164-41-003000

326-93-164-41-003000

SOCKET WRAP SOLDERTAIL SIP 64POS

Mill-Max Manufacturing Corp.

0 -
326-93-164-41-003000

数据表

326 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-314-ZSST

ICO-314-ZSST

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-314-ZSST

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled - Brass
115-87-950-41-001101

115-87-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
115-87-950-41-001101

数据表

115 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
517-83-403-19-111111

517-83-403-19-111111

CONN SOCKET PGA 403POS GOLD

Preci-Dip

0 -
517-83-403-19-111111

数据表

517 Bulk Active PGA 403 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-610-41-013101

116-83-610-41-013101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
116-83-610-41-013101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-43-952-61-006000

116-43-952-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-952-61-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APA-316-T-J

APA-316-T-J

ADAPTER PLUG

Samtec Inc.

0 -
APA-316-T-J

数据表

APA Tube Active - 16 (2 x 8) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
116-93-952-61-006000

116-93-952-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-952-61-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
6-1437529-6

6-1437529-6

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
6-1437529-6

数据表

500 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 6 (2 x 3) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Thermoplastic, Polyester 47.2µin (1.20µm) Copper Alloy
510-87-085-11-045101

510-87-085-11-045101

CONN SOCKET PGA 85POS GOLD

Preci-Dip

0 -
510-87-085-11-045101

数据表

510 Bulk Active PGA 85 (11 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-93-640-61-001000

116-93-640-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-640-61-001000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
540-44-084-17-400000

540-44-084-17-400000

CONN SOCKET PLCC 84POS TIN

Mill-Max Manufacturing Corp.

1 -
540-44-084-17-400000

数据表

540 Tube Obsolete PLCC 84 (4 x 21) Tin 150.0µin (3.81µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Copper Alloy
116-93-650-61-007000

116-93-650-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-650-61-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
550-10-292M20-001166

550-10-292M20-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
550-10-292M20-001166

数据表

550 Bulk Active BGA 292 (20 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
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