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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1-1571552-2CONN IC DIP SOCKET 40POS TIN |
0 | - |
|
数据表 |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Copper |
|
40-6575-11CONN IC DIP SOCKET ZIF 40POS TIN |
0 | - |
|
数据表 |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
|
13-0513-11HCONN SOCKET SIP 13POS GOLD |
0 | - |
|
数据表 |
0513 | Bulk | Active | SIP | 13 (1 x 13) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
116-83-420-41-009101CONN IC DIP SOCKET 20POS GOLD |
0 | - |
|
数据表 |
116 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
558-10-192M16-001101PGA SOLDER TAIL 1.27MM |
0 | - |
|
数据表 |
558 | Bulk | Active | PGA | 192 (16 x 16) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
ICA-314-ZSST.100" SCREW MACHINE DIP SOCKET |
0 | - |
|
数据表 |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | - | Brass |
|
326-93-164-41-003000SOCKET WRAP SOLDERTAIL SIP 64POS |
0 | - |
|
数据表 |
326 | Tube | Active | SIP | 64 (1 x 64) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
ICO-314-ZSST.100" LOW PROFILE SCREW MACHINE |
0 | - |
|
数据表 |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | - | Brass |
|
115-87-950-41-001101CONN IC DIP SOCKET 50POS GOLD |
0 | - |
|
数据表 |
115 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
517-83-403-19-111111CONN SOCKET PGA 403POS GOLD |
0 | - |
|
数据表 |
517 | Bulk | Active | PGA | 403 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
116-83-610-41-013101CONN IC DIP SOCKET 10POS GOLD |
0 | - |
|
数据表 |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
116-43-952-61-006000CONN IC SKT DBL |
0 | - |
|
数据表 |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
APA-316-T-JADAPTER PLUG |
0 | - |
|
数据表 |
APA | Tube | Active | - | 16 (2 x 8) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
116-93-952-61-006000CONN IC SKT DBL |
0 | - |
|
数据表 |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
6-1437529-6CONN IC DIP SOCKET 6POS GOLD |
0 | - |
|
数据表 |
500 | Bulk | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 6 (2 x 3) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Thermoplastic, Polyester | 47.2µin (1.20µm) | Copper Alloy |
|
510-87-085-11-045101CONN SOCKET PGA 85POS GOLD |
0 | - |
|
数据表 |
510 | Bulk | Active | PGA | 85 (11 x 11) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
116-93-640-61-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
540-44-084-17-400000CONN SOCKET PLCC 84POS TIN |
1 | - |
|
数据表 |
540 | Tube | Obsolete | PLCC | 84 (4 x 21) | Tin | 150.0µin (3.81µm) | Copper Alloy | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 150.0µin (3.81µm) | Copper Alloy |
|
116-93-650-61-007000CONN IC SKT DBL |
0 | - |
|
数据表 |
116 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
550-10-292M20-001166BGA PIN ADAPTER 1.27MM SMD |
0 | - |
|
数据表 |
550 | Bulk | Active | BGA | 292 (20 x 20) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
