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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
110-83-642-41-001101

110-83-642-41-001101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
110-83-642-41-001101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
643655-8

643655-8

CONN SOCKET SIP 23POS TIN

TE Connectivity AMP Connectors

0 -
643655-8

数据表

Diplomate DL Tray Obsolete SIP 23 (1 x 23) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
116-87-428-41-002101

116-87-428-41-002101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-428-41-002101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 42-HZL/07-TT

AR 42-HZL/07-TT

SOCKET

Assmann WSW Components

0 -
AR 42-HZL/07-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
116-87-324-41-001101

116-87-324-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-324-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0108-T-30

HLS-0108-T-30

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0108-T-30

数据表

HLS Tube Active SIP 8 (1 x 8) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
D0822-01

D0822-01

CONN IC DIP SOCKET 22POS GOLD

Harwin Inc.

0 -
D0822-01

数据表

D0 Bulk Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
33-0518-10T

33-0518-10T

CONN SOCKET SIP 33POS GOLD

Aries Electronics

0 -
33-0518-10T

数据表

518 Bulk Active SIP 33 (1 x 33) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
117-87-652-41-005101

117-87-652-41-005101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip

0 -
117-87-652-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICF-328-STL-I-TR

ICF-328-STL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-328-STL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
APH-0724-G-H

APH-0724-G-H

APH-0724-G-H

Samtec Inc.

0 -
APH-0724-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1724-G-H

APH-1724-G-H

APH-1724-G-H

Samtec Inc.

0 -
APH-1724-G-H

数据表

* - Active - - - - - - - - - - - - - - -
40-9503-21

40-9503-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-9503-21

数据表

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
40-9503-31

40-9503-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-9503-31

数据表

503 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
510-41-144-15-082001

510-41-144-15-082001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-41-144-15-082001

数据表

510 Bulk Active PGA 144 (15 x 15) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
116-43-652-61-007000

116-43-652-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-43-652-61-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-652-61-007000

116-93-652-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-652-61-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-964-61-001000

111-93-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-964-61-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
7100265148

7100265148

TEXTOOLRECEPTACLES FOR DIP SOCKE

3M

0 -
7100265148

数据表

- Bulk Active - - - - - - - - - - - - - - -
116-93-648-61-008000

116-93-648-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-648-61-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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