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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
232-1291-00-0602J

232-1291-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

3M

0 -
232-1291-00-0602J

数据表

Textool™ Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame 0.070" (1.78mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
115-43-964-61-001000

115-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-964-61-001000

数据表

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-952-61-001000

110-13-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-952-61-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
42-6556-31

42-6556-31

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

0 -
42-6556-31

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
42-6556-21

42-6556-21

CONN IC DIP SOCKET 42POS GOLD

Aries Electronics

0 -
42-6556-21

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
714-43-262-31-018000

714-43-262-31-018000

CONN IC DIP SOCKET 62POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-262-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 62 (2 x 31) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
APA-648-G-C

APA-648-G-C

ADAPTER PLUG

Samtec Inc.

0 -
APA-648-G-C

数据表

APA Bulk Active - 48 (2 x 24) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
APH-0432-G-H

APH-0432-G-H

APH-0432-G-H

Samtec Inc.

0 -
APH-0432-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0532-G-H

APH-0532-G-H

APH-0532-G-H

Samtec Inc.

0 -
APH-0532-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0632-G-H

APH-0632-G-H

APH-0632-G-H

Samtec Inc.

0 -
APH-0632-G-H

数据表

* - Active - - - - - - - - - - - - - - -
116-83-328-41-018101

116-83-328-41-018101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-328-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-318-41-801101

110-83-318-41-801101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
110-83-318-41-801101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
18-3513-10

18-3513-10

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-3513-10

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APH-0232-G-H

APH-0232-G-H

APH-0232-G-H

Samtec Inc.

0 -
APH-0232-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1332-G-H

APH-1332-G-H

APH-1332-G-H

Samtec Inc.

0 -
APH-1332-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0732-G-H

APH-0732-G-H

APH-0732-G-H

Samtec Inc.

0 -
APH-0732-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1132-G-H

APH-1132-G-H

APH-1132-G-H

Samtec Inc.

0 -
APH-1132-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1232-G-H

APH-1232-G-H

APH-1232-G-H

Samtec Inc.

0 -
APH-1232-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1732-G-H

APH-1732-G-H

APH-1732-G-H

Samtec Inc.

0 -
APH-1732-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1632-G-H

APH-1632-G-H

APH-1632-G-H

Samtec Inc.

0 -
APH-1632-G-H

数据表

* - Active - - - - - - - - - - - - - - -
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