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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
212-1-20-003

212-1-20-003

CONN IC DIP SOCKET 20POS GOLD

CNC Tech

0 -
212-1-20-003

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
116-83-318-41-001101

116-83-318-41-001101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-83-318-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
510-83-049-07-000101

510-83-049-07-000101

CONN SOCKET PGA 49POS GOLD

Preci-Dip

0 -
510-83-049-07-000101

数据表

510 Bulk Active PGA 49 (7 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
C8120-04

C8120-04

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

0 -
C8120-04

数据表

Edge-Grip™, C81 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
612-83-428-41-001101

612-83-428-41-001101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
612-83-428-41-001101

数据表

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-628-41-105161

110-83-628-41-105161

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
110-83-628-41-105161

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-642-41-105101

110-87-642-41-105101

CONN IC DIP SOCKET 42POS GOLD

Preci-Dip

0 -
110-87-642-41-105101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
117-87-656-41-005101

117-87-656-41-005101

CONN IC DIP SOCKET 56POS GOLD

Preci-Dip

0 -
117-87-656-41-005101

数据表

117 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
518-AG11D-ES

518-AG11D-ES

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

0 -
518-AG11D-ES

数据表

500 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polyester 25.0µin (0.63µm) Beryllium Copper
07-0503-20

07-0503-20

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0503-20

数据表

0503 Bulk Active SIP 7 (1 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
07-0503-30

07-0503-30

CONN SOCKET SIP 7POS GOLD

Aries Electronics

0 -
07-0503-30

数据表

0503 Bulk Active SIP 7 (1 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
40-C212-21

40-C212-21

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C212-21

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-C212-31

40-C212-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C212-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
40-C300-31

40-C300-31

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-C300-31

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
85-PGM11007-10H

85-PGM11007-10H

CONN SOCKET PGA GOLD

Aries Electronics

0 -
85-PGM11007-10H

数据表

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-93-652-61-003000

116-93-652-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-652-61-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-648-61-007000

116-93-648-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-648-61-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0930-G-R

APH-0930-G-R

APH-0930-G-R

Samtec Inc.

0 -
APH-0930-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1430-G-R

APH-1430-G-R

APH-1430-G-R

Samtec Inc.

0 -
APH-1430-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0530-G-R

APH-0530-G-R

APH-0530-G-R

Samtec Inc.

0 -
APH-0530-G-R

数据表

* - Active - - - - - - - - - - - - - - -
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