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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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40-6508-311CONN IC DIP SOCKET 40POS GOLD |
0 | - |
|
数据表 |
508 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
110-13-950-61-001000CONN IC SKT DBL |
0 | - |
|
数据表 |
110 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
116-43-964-61-007000CONN IC SKT DBL |
0 | - |
|
数据表 |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
116-93-964-61-007000CONN IC SKT DBL |
0 | - |
|
数据表 |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
HLS-0909-G-2.100" SCREW MACHINE SOCKET ARRAY |
0 | - |
|
数据表 |
HLS | Bulk | Active | SIP | 81 (9 x 9) | Gold | 30.0µin (0.76µm) | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | Gold | Thermoplastic | 10.0µin (0.25µm) | - |
|
517-83-401-19-101111CONN SOCKET PGA 401POS GOLD |
0 | - |
|
数据表 |
517 | Bulk | Active | PGA | 401 (19 x 19) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
116-83-322-41-007101CONN IC DIP SOCKET 22POS GOLD |
0 | - |
|
数据表 |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
510-87-084-10-001101CONN SOCKET PGA 84POS GOLD |
0 | - |
|
数据表 |
510 | Bulk | Active | PGA | 84 (10 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
510-87-084-10-031101CONN SOCKET PGA 84POS GOLD |
0 | - |
|
数据表 |
510 | Bulk | Active | PGA | 84 (10 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
HLS-0112-S-2.100" SCREW MACHINE SOCKET ARRAY |
0 | - |
|
数据表 |
HLS | Tube | Active | SIP | 12 (1 x 12) | Gold | - | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 140°C | - | Thermoplastic | - | - |
|
146-83-320-41-036101CONN IC DIP SOCKET 20POS GOLD |
0 | - |
|
数据表 |
146 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
612-87-432-41-001101CONN IC DIP SOCKET 32POS GOLD |
0 | - |
|
数据表 |
612 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
ICA-320-STT-L.100" SCREW MACHINE DIP SOCKET |
0 | - |
|
数据表 |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyester, Glass Filled | - | Brass |
|
ICF-624-T-I-TR.100" SURFACE MOUNT SCREW MACHIN |
0 | - |
|
数据表 |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
22-6513-10CONN IC DIP SOCKET 22POS GOLD |
0 | - |
|
数据表 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 22 (2 x 11) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
24-0518-11CONN SOCKET SIP 24POS GOLD |
0 | - |
|
数据表 |
518 | Bulk | Active | SIP | 24 (1 x 24) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
24-1518-11CONN IC DIP SOCKET 24POS GOLD |
0 | - |
|
数据表 |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 24 (2 x 12) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
614-83-624-31-012101CONN IC DIP SOCKET 24POS GOLD |
0 | - |
|
数据表 |
614 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
14-3513-10HCONN IC DIP SOCKET 14POS GOLD |
0 | - |
|
数据表 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
ICF-316-T-I.100" SURFACE MOUNT SCREW MACHIN |
0 | - |
|
数据表 |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
