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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-1030-G-R

APH-1030-G-R

APH-1030-G-R

Samtec Inc.

0 -
APH-1030-G-R

数据表

* - Active - - - - - - - - - - - - - - -
14-0518-11H

14-0518-11H

CONN SOCKET SIP 14POS GOLD

Aries Electronics

0 -
14-0518-11H

数据表

518 Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
14-1518-11H

14-1518-11H

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
14-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
APH-1630-G-R

APH-1630-G-R

APH-1630-G-R

Samtec Inc.

0 -
APH-1630-G-R

数据表

* - Active - - - - - - - - - - - - - - -
35-0518-10

35-0518-10

CONN SOCKET SIP 35POS GOLD

Aries Electronics

0 -
35-0518-10

数据表

518 Bulk Active SIP 35 (1 x 35) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APH-0730-G-R

APH-0730-G-R

APH-0730-G-R

Samtec Inc.

0 -
APH-0730-G-R

数据表

* - Active - - - - - - - - - - - - - - -
121-83-420-41-001101

121-83-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
121-83-420-41-001101

数据表

121 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-318-41-004101

116-87-318-41-004101

CONN IC DIP SOCKET 18POS GOLD

Preci-Dip

0 -
116-87-318-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-1130-G-R

APH-1130-G-R

APH-1130-G-R

Samtec Inc.

0 -
APH-1130-G-R

数据表

* - Active - - - - - - - - - - - - - - -
116-83-628-41-006101

116-83-628-41-006101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-83-628-41-006101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
612-87-640-41-001101

612-87-640-41-001101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip

0 -
612-87-640-41-001101

数据表

612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-0830-G-R

APH-0830-G-R

APH-0830-G-R

Samtec Inc.

0 -
APH-0830-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0230-G-R

APH-0230-G-R

APH-0230-G-R

Samtec Inc.

0 -
APH-0230-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0330-G-R

APH-0330-G-R

APH-0330-G-R

Samtec Inc.

0 -
APH-0330-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1730-G-R

APH-1730-G-R

APH-1730-G-R

Samtec Inc.

0 -
APH-1730-G-R

数据表

* - Active - - - - - - - - - - - - - - -
123-13-952-41-001000

123-13-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
123-13-952-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-43-964-61-105000

110-43-964-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-964-61-105000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
48-3553-11

48-3553-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
48-3553-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
116-93-950-61-006000

116-93-950-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-950-61-006000

数据表

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
40-6508-211

40-6508-211

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6508-211

数据表

508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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