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IC 插座
| 图片 | 厂商料号 | 库存情况 | 价格 | 数量 | 数据表 | 系列 | 包装 | 产品状态 | 类型 | 位置或引脚数量(网格) | 触点表面处理 - 配对 | 触点表面处理厚度 - 配对部分 | 触点材料 - 配对部分 | 安装类型 | 特性 | 配对间距 | 端接方式 | 引脚间距 | 工作温度 | 触点表面处理 - 引脚 | 外壳材料 | 触点表面处理厚度 - 引脚 | 触点材料 - 引脚 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
117-93-764-61-005000CONN IC SKT DBL |
0 | - |
|
数据表 |
117 | Tube | Active | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
510-13-064-08-000001SKT PGA SOLDRTL |
0 | - |
|
数据表 |
510 | Bulk | Active | PGA | 64 (8 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
APO-640-G-H.100" LOW PROFILE SCREW MACHINE |
0 | - |
|
数据表 |
APO | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Phosphor Bronze |
|
APH-1024-G-HAPH-1024-G-H |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-1124-G-HAPH-1124-G-H |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
APH-0624-G-HAPH-0624-G-H |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
10-6513-11CONN IC DIP SOCKET 10POS GOLD |
0 | - |
|
数据表 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
13-0518-00CONN SOCKET SIP 13POS GOLD |
0 | - |
|
数据表 |
518 | Bulk | Active | SIP | 13 (1 x 13) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
26-0518-10CONN SOCKET SIP 26POS GOLD |
0 | - |
|
数据表 |
518 | Bulk | Active | SIP | 26 (1 x 26) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
299-87-314-10-001101CONN IC DIP SOCKET 14POS GOLD |
0 | - |
|
数据表 |
299 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
28-6513-10TCONN IC DIP SOCKET 28POS GOLD |
0 | - |
|
数据表 |
Lo-PRO®file, 513 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
20-4518-11CONN IC DIP SOCKET 20POS GOLD |
0 | - |
|
数据表 |
518 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyamide (PA46), Nylon 4/6, Glass Filled | 10.0µin (0.25µm) | Brass |
|
36-0518-10CONN SOCKET SIP 36POS GOLD |
0 | - |
|
数据表 |
518 | Bulk | Active | SIP | 36 (1 x 36) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
APH-0224-G-HAPH-0224-G-H |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
36-1518-10CONN IC DIP SOCKET 36POS GOLD |
0 | - |
|
数据表 |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 36 (2 x 18) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Brass |
|
APH-1624-G-HAPH-1624-G-H |
0 | - |
|
数据表 |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
10-6511-10SOCKET 10 POS SOLDER TAIL TIN |
0 | - |
|
数据表 |
511 | - | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 200.0µin (5.08µm) | Phosphor Bronze |
|
ICF-624-TM-O-TR.100" SURFACE MOUNT SCREW MACHIN |
0 | - |
|
数据表 |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Liquid Crystal Polymer (LCP) | - | Beryllium Copper |
|
110-87-950-41-001101CONN IC DIP SOCKET 50POS GOLD |
0 | - |
|
数据表 |
110 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
08-0511-10CONN SOCKET SIP 8POS TIN |
0 | - |
|
数据表 |
511 | Bulk | Active | SIP | 8 (1 x 8) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polyamide (PA46), Nylon 4/6, Glass Filled | 50.0µin (1.27µm) | Phosphor Bronze |
