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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
117-93-764-61-005000

117-93-764-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-93-764-61-005000

数据表

117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-13-064-08-000001

510-13-064-08-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
510-13-064-08-000001

数据表

510 Bulk Active PGA 64 (8 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
APO-640-G-H

APO-640-G-H

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-640-G-H

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
APH-1024-G-H

APH-1024-G-H

APH-1024-G-H

Samtec Inc.

0 -
APH-1024-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1124-G-H

APH-1124-G-H

APH-1124-G-H

Samtec Inc.

0 -
APH-1124-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0624-G-H

APH-0624-G-H

APH-0624-G-H

Samtec Inc.

0 -
APH-0624-G-H

数据表

* - Active - - - - - - - - - - - - - - -
10-6513-11

10-6513-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-6513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
13-0518-00

13-0518-00

CONN SOCKET SIP 13POS GOLD

Aries Electronics

0 -
13-0518-00

数据表

518 Bulk Active SIP 13 (1 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
26-0518-10

26-0518-10

CONN SOCKET SIP 26POS GOLD

Aries Electronics

0 -
26-0518-10

数据表

518 Bulk Active SIP 26 (1 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
299-87-314-10-001101

299-87-314-10-001101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
299-87-314-10-001101

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
28-6513-10T

28-6513-10T

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-6513-10T

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-4518-11

20-4518-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4518-11

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
36-0518-10

36-0518-10

CONN SOCKET SIP 36POS GOLD

Aries Electronics

0 -
36-0518-10

数据表

518 Bulk Active SIP 36 (1 x 36) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APH-0224-G-H

APH-0224-G-H

APH-0224-G-H

Samtec Inc.

0 -
APH-0224-G-H

数据表

* - Active - - - - - - - - - - - - - - -
36-1518-10

36-1518-10

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

0 -
36-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 36 (2 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APH-1624-G-H

APH-1624-G-H

APH-1624-G-H

Samtec Inc.

0 -
APH-1624-G-H

数据表

* - Active - - - - - - - - - - - - - - -
10-6511-10

10-6511-10

SOCKET 10 POS SOLDER TAIL TIN

Aries Electronics

0 -
10-6511-10

数据表

511 - Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
ICF-624-TM-O-TR

ICF-624-TM-O-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-624-TM-O-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
110-87-950-41-001101

110-87-950-41-001101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

0 -
110-87-950-41-001101

数据表

110 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
08-0511-10

08-0511-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

0 -
08-0511-10

数据表

511 Bulk Active SIP 8 (1 x 8) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 50.0µin (1.27µm) Phosphor Bronze
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