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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-87-420-41-001101

116-87-420-41-001101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-420-41-001101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-636-41-005101

110-83-636-41-005101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

0 -
110-83-636-41-005101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-320-41-008101

116-83-320-41-008101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-320-41-008101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-83-320-41-035101

146-83-320-41-035101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
146-83-320-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-83-420-41-035101

146-83-420-41-035101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
146-83-420-41-035101

数据表

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-83-420-41-036101

146-83-420-41-036101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
146-83-420-41-036101

数据表

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
121-83-322-41-001101

121-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
121-83-322-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-422-41-003101

116-83-422-41-003101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-422-41-003101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
15-0513-11H

15-0513-11H

CONN SOCKET SIP 15POS GOLD

Aries Electronics

0 -
15-0513-11H

数据表

0513 Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-0513-11

18-0513-11

CONN SOCKET SIP 18POS GOLD

Aries Electronics

0 -
18-0513-11

数据表

0513 Bulk Active SIP 18 (1 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
23-0518-11

23-0518-11

CONN SOCKET SIP 23POS GOLD

Aries Electronics

0 -
23-0518-11

数据表

518 Bulk Active SIP 23 (1 x 23) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
34-0518-10

34-0518-10

CONN SOCKET SIP 34POS GOLD

Aries Electronics

0 -
34-0518-10

数据表

518 Bulk Active SIP 34 (1 x 34) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APA-308-T-N

APA-308-T-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-308-T-N

数据表

APA Tube Active - 8 (2 x 4) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
HLS-0108-T-10

HLS-0108-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0108-T-10

数据表

HLS Tube Active SIP 8 (1 x 8) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
346-93-108-41-013000

346-93-108-41-013000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-108-41-013000

数据表

346 Tube Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-108-41-013000

346-43-108-41-013000

CONN SOCKET SIP 8POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-108-41-013000

数据表

346 Tube Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-83-225-18-091135

546-83-225-18-091135

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
546-83-225-18-091135

数据表

546 Bulk Active PGA 225 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
546-83-225-18-091136

546-83-225-18-091136

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
546-83-225-18-091136

数据表

546 Bulk Active PGA 225 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
123-11-952-41-001000

123-11-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-952-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
APA-648-G-N

APA-648-G-N

ADAPTER PLUG

Samtec Inc.

0 -
APA-648-G-N

数据表

APA Tube Active - 48 (2 x 24) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
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