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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
28-3508-21

28-3508-21

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3508-21

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
28-3508-31

28-3508-31

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3508-31

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
APH-1830-G-T

APH-1830-G-T

APH-1830-G-T

Samtec Inc.

0 -
APH-1830-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1530-G-T

APH-1530-G-T

APH-1530-G-T

Samtec Inc.

0 -
APH-1530-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0530-G-T

APH-0530-G-T

APH-0530-G-T

Samtec Inc.

0 -
APH-0530-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1030-G-T

APH-1030-G-T

APH-1030-G-T

Samtec Inc.

0 -
APH-1030-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0630-G-T

APH-0630-G-T

APH-0630-G-T

Samtec Inc.

0 -
APH-0630-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0230-G-T

APH-0230-G-T

APH-0230-G-T

Samtec Inc.

0 -
APH-0230-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0330-G-T

APH-0330-G-T

APH-0330-G-T

Samtec Inc.

0 -
APH-0330-G-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1330-G-T

APH-1330-G-T

APH-1330-G-T

Samtec Inc.

0 -
APH-1330-G-T

数据表

* - Active - - - - - - - - - - - - - - -
110-43-652-61-105000

110-43-652-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-652-61-105000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-952-61-105000

110-43-952-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-952-61-105000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
32-6575-11

32-6575-11

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

0 -
32-6575-11

数据表

57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
XR2C2611N

XR2C2611N

CONN SOCKET SIP 26POS GOLD

Omron Electronics Inc-EMC Div

0 -
XR2C2611N

数据表

XR2 Bulk Obsolete SIP 26 (1 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Threaded - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Brass
517-83-370-19-121111

517-83-370-19-121111

CONN SOCKET PGA 370POS GOLD

Preci-Dip

0 -
517-83-370-19-121111

数据表

517 Bulk Active PGA 370 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-93-640-61-007000

116-93-640-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-640-61-007000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-87-320-41-011101

116-87-320-41-011101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-87-320-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0515-G-2

HLS-0515-G-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0515-G-2

数据表

HLS Bulk Active SIP 75 (5 x 15) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
HLS-0207-TT-11

HLS-0207-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0207-TT-11

数据表

HLS Tube Active SIP 14 (2 x 7) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
APO-318-T-J

APO-318-T-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-318-T-J

数据表

APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
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