富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0428-G-R

APH-0428-G-R

APH-0428-G-R

Samtec Inc.

0 -
APH-0428-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0528-G-R

APH-0528-G-R

APH-0528-G-R

Samtec Inc.

0 -
APH-0528-G-R

数据表

* - Active - - - - - - - - - - - - - - -
115-87-648-41-003101

115-87-648-41-003101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip

0 -
115-87-648-41-003101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-324-41-105191

110-87-324-41-105191

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
110-87-324-41-105191

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-1428-G-R

APH-1428-G-R

APH-1428-G-R

Samtec Inc.

0 -
APH-1428-G-R

数据表

* - Active - - - - - - - - - - - - - - -
116-83-420-41-002101

116-83-420-41-002101

CONN IC DIP SOCKET 20POS GOLD

Preci-Dip

0 -
116-83-420-41-002101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-1528-G-R

APH-1528-G-R

APH-1528-G-R

Samtec Inc.

0 -
APH-1528-G-R

数据表

* - Active - - - - - - - - - - - - - - -
ICA-308-SST-L

ICA-308-SST-L

.100" SCREW MACHINE DIP SOCKET

Samtec Inc.

0 -
ICA-308-SST-L

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled - Brass
APH-0628-G-R

APH-0628-G-R

APH-0628-G-R

Samtec Inc.

0 -
APH-0628-G-R

数据表

* - Active - - - - - - - - - - - - - - -
10-3513-11

10-3513-11

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

0 -
10-3513-11

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
APH-0828-G-R

APH-0828-G-R

APH-0828-G-R

Samtec Inc.

0 -
APH-0828-G-R

数据表

* - Active - - - - - - - - - - - - - - -
17-0513-10H

17-0513-10H

CONN SOCKET SIP 17POS GOLD

Aries Electronics

0 -
17-0513-10H

数据表

0513 Bulk Active SIP 17 (1 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
14-C195-10T

14-C195-10T

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

0 -
14-C195-10T

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-83-422-41-012101

116-83-422-41-012101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-83-422-41-012101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-632-41-134191

114-83-632-41-134191

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
114-83-632-41-134191

数据表

114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
20-3518-11

20-3518-11

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3518-11

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
116-87-322-41-009101

116-87-322-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-322-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-87-424-41-035101

146-87-424-41-035101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
146-87-424-41-035101

数据表

146 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
D01-9951442

D01-9951442

CONN SOCKET SIP 14POS GOLD

Harwin Inc.

0 -
D01-9951442

数据表

D01-995 Tube Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
818-AG10D

818-AG10D

CONN IC DIP SOCKET 18POS GOLD

TE Connectivity AMP Connectors

0 -
818-AG10D

数据表

800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 25.0µin (0.63µm) Copper Alloy Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C - Polyester - -
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户