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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
550-10-272M20-001166

550-10-272M20-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
550-10-272M20-001166

数据表

550 Bulk Active BGA 272 (20 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
110-13-324-61-801000

110-13-324-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-324-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
2-821949-5

2-821949-5

CONN SOCKET PQFP 132POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
2-821949-5

数据表

- Tube Obsolete QFP 132 (4 x 33) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin-Lead Liquid Crystal Polymer (LCP) 200.0µin (5.08µm) Phosphor Bronze
APH-1822-G-H

APH-1822-G-H

APH-1822-G-H

Samtec Inc.

0 -
APH-1822-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0922-G-H

APH-0922-G-H

APH-0922-G-H

Samtec Inc.

0 -
APH-0922-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1922-G-H

APH-1922-G-H

APH-1922-G-H

Samtec Inc.

0 -
APH-1922-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1522-G-H

APH-1522-G-H

APH-1522-G-H

Samtec Inc.

0 -
APH-1522-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1022-G-H

APH-1022-G-H

APH-1022-G-H

Samtec Inc.

0 -
APH-1022-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0222-G-H

APH-0222-G-H

APH-0222-G-H

Samtec Inc.

0 -
APH-0222-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0322-G-H

APH-0322-G-H

APH-0322-G-H

Samtec Inc.

0 -
APH-0322-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0422-G-H

APH-0422-G-H

APH-0422-G-H

Samtec Inc.

0 -
APH-0422-G-H

数据表

* - Active - - - - - - - - - - - - - - -
121-13-964-41-001000

121-13-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
121-13-964-41-001000

数据表

121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
116-93-648-61-006000

116-93-648-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-648-61-006000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0520-S-2

HLS-0520-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0520-S-2

数据表

HLS Bulk Active SIP 100 (5 x 20) Gold - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
117-93-652-61-005000

117-93-652-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
117-93-652-61-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
546-83-225-17-003135

546-83-225-17-003135

CONN SOCKET PGA 225POS GOLD

Preci-Dip

0 -
546-83-225-17-003135

数据表

546 Bulk Active PGA 225 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
110-13-648-61-001000

110-13-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-648-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
110-43-964-61-001000

110-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-964-61-001000

数据表

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0320-T-18

HLS-0320-T-18

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0320-T-18

数据表

HLS Tube Active SIP 60 (3 x 20) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
110-43-640-61-801000

110-43-640-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-43-640-61-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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