富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
116-87-328-41-012101

116-87-328-41-012101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip

0 -
116-87-328-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
122-83-422-41-001101

122-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
122-83-422-41-001101

数据表

122 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
123-83-422-41-001101

123-83-422-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
123-83-422-41-001101

数据表

123 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-314-41-004101

116-83-314-41-004101

CONN IC DIP SOCKET 14POS GOLD

Preci-Dip

0 -
116-83-314-41-004101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-316-41-011101

116-83-316-41-011101

CONN IC DIP SOCKET 16POS GOLD

Preci-Dip

0 -
116-83-316-41-011101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-1128-G-R

APH-1128-G-R

APH-1128-G-R

Samtec Inc.

0 -
APH-1128-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0228-G-R

APH-0228-G-R

APH-0228-G-R

Samtec Inc.

0 -
APH-0228-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1328-G-R

APH-1328-G-R

APH-1328-G-R

Samtec Inc.

0 -
APH-1328-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1228-G-R

APH-1228-G-R

APH-1228-G-R

Samtec Inc.

0 -
APH-1228-G-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-0728-G-R

APH-0728-G-R

APH-0728-G-R

Samtec Inc.

0 -
APH-0728-G-R

数据表

* - Active - - - - - - - - - - - - - - -
517-83-372-19-111111

517-83-372-19-111111

CONN SOCKET PGA 372POS GOLD

Preci-Dip

0 -
517-83-372-19-111111

数据表

517 Bulk Active PGA 372 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
C9114-00

C9114-00

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

0 -
C9114-00

数据表

Edge-Grip™, C91 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
34-1518-10

34-1518-10

CONN IC DIP SOCKET 34POS GOLD

Aries Electronics

0 -
34-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
09-0517-90C

09-0517-90C

CONN SOCKET SIP 9POS GOLD

Aries Electronics

0 -
09-0517-90C

数据表

0517 Bulk Active SIP 9 (1 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0205-T-22

HLS-0205-T-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0205-T-22

数据表

HLS Tube Active SIP 10 (2 x 5) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
1050282031

1050282031

CONN CAMERA SOCKET 32POS GOLD

Molex

0 -
1050282031

数据表

105028 Tape & Reel (TR) Obsolete Camera Socket 32 (4 x 8) Gold 12.0µin (0.30µm) Copper Alloy Surface Mount Open Frame 0.035" (0.90mm) Solder 0.035" (0.90mm) - Gold Plastic Flash Copper Alloy
1571541-3

1571541-3

CONN SOCKET PLCC 68POS TIN

TE Connectivity AMP Connectors

0 -
1571541-3

数据表

PCS Bulk Obsolete PLCC 68 (4 x 17) Tin 180.0µin (4.57µm) Copper Alloy Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) 180.0µin (4.57µm) Copper Alloy
08-3513-10H

08-3513-10H

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3513-10H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
19-0513-10T

19-0513-10T

CONN SOCKET SIP 19POS GOLD

Aries Electronics

0 -
19-0513-10T

数据表

0513 Bulk Active SIP 19 (1 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-87-624-41-007101

116-87-624-41-007101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-87-624-41-007101

数据表

116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户