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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
612-83-424-41-001101

612-83-424-41-001101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
612-83-424-41-001101

数据表

612 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
PLCC-028-T-N-TR

PLCC-028-T-N-TR

CONN SOCKET PLCC 28POS TIN

Samtec Inc.

0 -
PLCC-028-T-N-TR

数据表

PLCC Tape & Reel (TR) Obsolete PLCC 28 (4 x 7) Tin - Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
114-83-324-41-134191

114-83-324-41-134191

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
114-83-324-41-134191

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APO-308-G-J

APO-308-G-J

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-308-G-J

数据表

APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
117-87-432-41-105101

117-87-432-41-105101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip

0 -
117-87-432-41-105101

数据表

117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold Flash Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
122-83-322-41-001101

122-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
122-83-322-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
123-83-322-41-001101

123-83-322-41-001101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
123-83-322-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
299-83-608-10-002101

299-83-608-10-002101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
299-83-608-10-002101

数据表

299 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
20-3518-00

20-3518-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-3518-00

数据表

518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
20-4518-00

20-4518-00

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

0 -
20-4518-00

数据表

518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-83-424-41-003101

116-83-424-41-003101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip

0 -
116-83-424-41-003101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
ICF-318-TL-I-TR

ICF-318-TL-I-TR

.100" SURFACE MOUNT SCREW MACHIN

Samtec Inc.

0 -
ICF-318-TL-I-TR

数据表

ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
110-13-318-61-801000

110-13-318-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-318-61-801000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
123-11-950-41-001000

123-11-950-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
123-11-950-41-001000

数据表

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
514-87-256M20-001148

514-87-256M20-001148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

0 -
514-87-256M20-001148

数据表

514 Bulk Active BGA 256 (20 x 20) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
514-87-256M16-000148

514-87-256M16-000148

CONN SOCKET BGA 256POS GOLD

Preci-Dip

0 -
514-87-256M16-000148

数据表

514 Bulk Active BGA 256 (16 x 16) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-93-642-61-003000

116-93-642-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-642-61-003000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-256-31-018000

714-43-256-31-018000

CONN IC DIP SOCKET 56POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-256-31-018000

数据表

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 56 (2 x 28) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
324-93-164-41-002000

324-93-164-41-002000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
324-93-164-41-002000

数据表

324 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-13-952-41-001000

122-13-952-41-001000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.

0 -
122-13-952-41-001000

数据表

122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
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