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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
122-11-964-41-001000

122-11-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
122-11-964-41-001000

数据表

122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
APO-628-G-R

APO-628-G-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-628-G-R

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
517-83-411-20-111111

517-83-411-20-111111

CONN SOCKET PGA 411POS GOLD

Preci-Dip

0 -
517-83-411-20-111111

数据表

517 Bulk Active PGA 411 (20 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-0430-G-H

APH-0430-G-H

APH-0430-G-H

Samtec Inc.

0 -
APH-0430-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1030-G-H

APH-1030-G-H

APH-1030-G-H

Samtec Inc.

0 -
APH-1030-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0630-G-H

APH-0630-G-H

APH-0630-G-H

Samtec Inc.

0 -
APH-0630-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1130-G-H

APH-1130-G-H

APH-1130-G-H

Samtec Inc.

0 -
APH-1130-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0230-G-H

APH-0230-G-H

APH-0230-G-H

Samtec Inc.

0 -
APH-0230-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0830-G-H

APH-0830-G-H

APH-0830-G-H

Samtec Inc.

0 -
APH-0830-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0330-G-H

APH-0330-G-H

APH-0330-G-H

Samtec Inc.

0 -
APH-0330-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1730-G-H

APH-1730-G-H

APH-1730-G-H

Samtec Inc.

0 -
APH-1730-G-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1630-G-H

APH-1630-G-H

APH-1630-G-H

Samtec Inc.

0 -
APH-1630-G-H

数据表

* - Active - - - - - - - - - - - - - - -
111-43-950-61-001000

111-43-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-43-950-61-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-950-61-001000

111-93-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
111-93-950-61-001000

数据表

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-650-61-001000

110-13-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-13-650-61-001000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
550-10-169-17-101101

550-10-169-17-101101

PGA SOLDER TAIL

Preci-Dip

0 -
550-10-169-17-101101

数据表

550 Bulk Active PGA 169 (17 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
116-93-640-61-008000

116-93-640-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
116-93-640-61-008000

数据表

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-93-668-41-005000

117-93-668-41-005000

CONN IC DIP SOCKET 68POS GOLD

Mill-Max Manufacturing Corp.

3 -
117-93-668-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-87-422-41-009101

116-87-422-41-009101

CONN IC DIP SOCKET 22POS GOLD

Preci-Dip

0 -
116-87-422-41-009101

数据表

116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
514-AG12D-LF

514-AG12D-LF

CONN IC DIP SOCKET 14POS TIN

TE Connectivity AMP Connectors

0 -
514-AG12D-LF

数据表

500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Beryllium Copper
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