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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
AW 127-28/Z-T

AW 127-28/Z-T

SOCKET 28 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-28/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
232-68

232-68

CONN SOCKET PLCC 68POS TIN

CNC Tech

0 -
232-68

数据表

- Tube Obsolete PLCC 68 (4 x 17) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
SIP1X16-014B

SIP1X16-014B

SIP1X16-014B-SIP SOCKET 16 CTS

Amphenol ICC (FCI)

0 -
SIP1X16-014B

数据表

SIP1x Bulk Active SIP 16 (1 x 16) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
A-CCS28-Z-SM-R

A-CCS28-Z-SM-R

CONN SOCKET PLCC 28POS TIN

Assmann WSW Components

0 -
A-CCS28-Z-SM-R

数据表

- Tube Obsolete PLCC 28 (4 x 7) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
A-CCS44-Z

A-CCS44-Z

CONN SOCKET PLCC 44POS TIN

Assmann WSW Components

0 -
A-CCS44-Z

数据表

- Bag Obsolete PLCC 44 (4 x 11) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
110-87-308-41-105161

110-87-308-41-105161

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
110-87-308-41-105161

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-308-41-006101

116-87-308-41-006101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-87-308-41-006101

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
382441-3

382441-3

CONN SOCKET SIP 7POS TIN

TE Connectivity AMP Connectors

0 -
382441-3

数据表

Diplomate DL Tray Obsolete SIP 7 (1 x 7) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
2-382568-4

2-382568-4

CONN IC DIP SOCKET 24POS TIN

TE Connectivity AMP Connectors

0 -
2-382568-4

数据表

Diplomate DL Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
2-640463-4

2-640463-4

CONN IC DIP SOCKET 8POS GOLD

TE Connectivity AMP Connectors

0 -
2-640463-4

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 15.0µin (0.38µm) Phosphor Bronze
ED044PLCZ-SM-N

ED044PLCZ-SM-N

CONN SOCKET PLCC 44POS

On Shore Technology Inc.

0 -
ED044PLCZ-SM-N

数据表

ED Tube Active PLCC 44 (2 x 22) - - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C - Polyphenylene Sulfide (PPS) - Phosphor Bronze
614-83-306-41-001101

614-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
614-83-306-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 08-HZL/07-TT

AR 08-HZL/07-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

0 -
AR 08-HZL/07-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
123-87-306-41-001101

123-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
123-87-306-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-304-41-007101

116-83-304-41-007101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-83-304-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
D0806-01

D0806-01

CONN IC DIP SOCKET 6POS GOLD

Harwin Inc.

0 -
D0806-01

数据表

D0 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 196.9µin (5.00µm) Brass
SIP050-1X08-157B

SIP050-1X08-157B

1X08-157B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X08-157B

数据表

SIP050-1x Bulk Active SIP 8 (1 x 8) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
231-20

231-20

CONN SOCKET PLCC 20POS GOLD

CNC Tech

0 -
231-20

数据表

- Tube Obsolete PLCC 20 (4 x 5) Gold - Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
AW 127-29/Z-T

AW 127-29/Z-T

SOCKET 29 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-29/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
917-87-103-41-005101

917-87-103-41-005101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip

0 -
917-87-103-41-005101

数据表

917 Bulk Active Transistor, TO-5 3 (Round) Gold Flash Beryllium Copper Through Hole - - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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