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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
940-99-068-17-400000

940-99-068-17-400000

CONN SOCKET PLCC 68POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-068-17-400000

数据表

940 Tube Obsolete PLCC 68 (4 x 17) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
WMS-240Z

WMS-240Z

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

0 -
WMS-240Z

数据表

WMS Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - 200.0µin (5.08µm) Brass
WMS-2410Z

WMS-2410Z

CONN IC DIP SOCKET 24POS GOLD

On Shore Technology Inc.

0 -
WMS-2410Z

数据表

WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - 200.0µin (5.08µm) Brass
DIP324-014B

DIP324-014B

DIP324-014B-DIP SOCKET 24 CTS

Amphenol ICC (FCI)

0 -
DIP324-014B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
1814655-1

1814655-1

CONN SOCKET SIP 4POS GOLD

TE Connectivity AMP Connectors

0 -
1814655-1

数据表

- Bulk Obsolete SIP 4 (1 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Polyester 29.5µin (0.75µm) Brass
SIP1X15-011B

SIP1X15-011B

SIP1X15-011B-SIP SOCKET 15 CTS

Amphenol ICC (FCI)

0 -
SIP1X15-011B

数据表

SIP1x Bulk Active SIP 15 (1 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
116-87-306-41-002101

116-87-306-41-002101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 24 HZL/7-TT

AR 24 HZL/7-TT

SOCKET

Assmann WSW Components

0 -
AR 24 HZL/7-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
SIP1X13-001B

SIP1X13-001B

SIP1X13-001B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

0 -
SIP1X13-001B

数据表

SIP1x Bulk Active SIP 13 (1 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
HLS-0103-TT-11

HLS-0103-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0103-TT-11

数据表

HLS Tube Active SIP 3 (1 x 3) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
110-87-210-01-742101

110-87-210-01-742101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-87-210-01-742101

数据表

110 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5), 6 Loaded Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A16-LCG-T-R

A16-LCG-T-R

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

0 -
A16-LCG-T-R

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold - - Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled - -
A-CCS84-Z

A-CCS84-Z

CONN SOCKET PLCC 84POS TIN

Assmann WSW Components

0 -
A-CCS84-Z

数据表

- Bag Obsolete PLCC 84 (4 x 21) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
114-83-308-41-134161

114-83-308-41-134161

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
114-83-308-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-306-41-018101

116-83-306-41-018101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-83-306-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 42-HZL-TT

AR 42-HZL-TT

SOCKET

Assmann WSW Components

0 -
AR 42-HZL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
116-87-308-41-003101

116-87-308-41-003101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-87-308-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
940-99-052-17-400000

940-99-052-17-400000

CONN SOCKET PLCC 52POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-052-17-400000

数据表

940 Tube Obsolete PLCC 52 (4 x 13) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
122-87-306-41-001101

122-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
122-87-306-41-001101

数据表

122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-304-41-009101

116-83-304-41-009101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-83-304-41-009101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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