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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
AR 06-HZW/TN

AR 06-HZW/TN

SOCKET

Assmann WSW Components

0 -
AR 06-HZW/TN

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
03-0513-10

03-0513-10

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0513-10

数据表

0513 Bulk Active SIP 3 (1 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
121-83-304-41-001101

121-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
121-83-304-41-001101

数据表

121 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS028-Z-SM/P

A-CCS028-Z-SM/P

SOCKET

Assmann WSW Components

0 -
A-CCS028-Z-SM/P

数据表

- Bulk Active PLCC 28 Tin 160.0µin (4.06µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 160.0µin (4.06µm) Phosphor Bronze
AR08-HZW/T

AR08-HZW/T

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

0 -
AR08-HZW/T

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
A-CCS20-Z-SM-R

A-CCS20-Z-SM-R

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components

0 -
A-CCS20-Z-SM-R

数据表

- Tube Obsolete PLCC 20 (4 x 5) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
SU1210000000G

SU1210000000G

SU-2*6P BLACK ; 10.0MM CLIP PLA

Amphenol Anytek

0 -
SU1210000000G

数据表

SU Bulk Active DIP, 0.1" (2.54mm) Row Spacing 12 (2 x 6) Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polyphenylene Sulfide (PPS) Flash Beryllium Copper
2-641264-1

2-641264-1

CONN IC DIP SOCKET 20POS TIN

TE Connectivity AMP Connectors

0 -
2-641264-1

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic, Glass Filled - Beryllium Copper
110-87-610-41-001101

110-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
110-87-610-41-001101

数据表

110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-304-41-012101

116-83-304-41-012101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-83-304-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AW 127-26/Z-T

AW 127-26/Z-T

SOCKET 26 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-26/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
SIP1X14-011B

SIP1X14-011B

SIP1X14-011B-SIP SOCKET 14 CTS

Amphenol ICC (FCI)

0 -
SIP1X14-011B

数据表

SIP1x Bulk Active SIP 14 (1 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
110-87-312-41-005101

110-87-312-41-005101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
110-87-312-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-610-41-001101

115-87-610-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
115-87-610-41-001101

数据表

115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
BU080Z

BU080Z

CONN IC DIP SOCKET 8POS

On Shore Technology Inc.

43 -
BU080Z

数据表

BU Tube Active - 8 (2 x 4) - - - - - - - - - - - - -
AR16-HZL/01-TT

AR16-HZL/01-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

0 -
AR16-HZL/01-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
A-CCS52-Z

A-CCS52-Z

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components

0 -
A-CCS52-Z

数据表

- Bag Obsolete PLCC 52 (4 x 13) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
04-0518-10H

04-0518-10H

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0518-10H

数据表

518 Bulk Active SIP 4 (1 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
04-1518-10H

04-1518-10H

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1518-10H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
05-0518-10

05-0518-10

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0518-10

数据表

518 Bulk Active SIP 5 (1 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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