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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
0050395288

0050395288

CONN IC DIP SOCKET 28POS TINLEAD

Molex

0 -
0050395288

数据表

- - Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin-Lead - - Through Hole Closed Frame 0.100" (2.54mm) - - - - - - -
940-99-032-24-000000

940-99-032-24-000000

CONN SOCKET PLCC 32POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-032-24-000000

数据表

940 Tube Obsolete PLCC 32 (2 x 7, 2 x 9) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
SIP1X11-011B

SIP1X11-011B

SIP1X11-011B-SIP SOCKET 11 CTS

Amphenol ICC (FCI)

0 -
SIP1X11-011B

数据表

SIP1x Bulk Active SIP 11 (1 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
AR 22-HGL-TT

AR 22-HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 22-HGL-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
AR22-HZL-TT

AR22-HZL-TT

CONN IC DIP SOCKET 22POS TIN

Assmann WSW Components

0 -
AR22-HZL-TT

数据表

- Bag Obsolete DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
115-83-306-41-003101

115-83-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
115-83-306-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-304-41-001101

116-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-001101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS44-Z-SM

A-CCS44-Z-SM

CONN SOCKET PLCC 44POS TIN

Assmann WSW Components

0 -
A-CCS44-Z-SM

数据表

- Bag Obsolete PLCC 44 (4 x 11) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
HLS-0201-T-2

HLS-0201-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0201-T-2

数据表

HLS Tube Active SIP 2 (2 x 1) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
940-99-044-24-000000

940-99-044-24-000000

CONN SOCKET PLCC 44POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-044-24-000000

数据表

940 Tube Obsolete PLCC 44 (4 x 11) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
940-99-020-17-400000

940-99-020-17-400000

CONN SOCKET PLCC 20POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-020-17-400000

数据表

940 Tube Obsolete PLCC 20 (4 x 5) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
AJ 24-LC

AJ 24-LC

SOCKET

Assmann WSW Components

0 -
AJ 24-LC

数据表

- Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
123-83-304-41-001101

123-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
123-83-304-41-001101

数据表

123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DIP318-011B

DIP318-011B

DIP318-011B-DIP SOCKET 18 CTS

Amphenol ICC (FCI)

0 -
DIP318-011B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
04-1518-10T

04-1518-10T

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1518-10T

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
SIP1X09-001B

SIP1X09-001B

SIP1X09-001B-SIP SOCKET 9 CTS

Amphenol ICC (FCI)

0 -
SIP1X09-001B

数据表

SIP1x Bulk Active SIP 9 (1 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
SIP050-1X07-157B

SIP050-1X07-157B

1X07-157B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X07-157B

数据表

SIP050-1x Bulk Active SIP 7 (1 x 7) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
SIP1X13-011B

SIP1X13-011B

SIP1X13-011B-SIP SOCKET 13 CTS

Amphenol ICC (FCI)

0 -
SIP1X13-011B

数据表

SIP1x Bulk Active SIP 13 (1 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
SIP050-1X06-160B

SIP050-1X06-160B

1X06-160B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X06-160B

数据表

SIP050-1x Bulk Active SIP 6 (1 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
AR20-HZL-TT

AR20-HZL-TT

CONN IC DIP SOCKET 20POS TIN

Assmann WSW Components

0 -
AR20-HZL-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
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