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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
917-87-103-41-053101

917-87-103-41-053101

CONN TRANSIST TO-5 3POS GOLD

Preci-Dip

0 -
917-87-103-41-053101

数据表

917 Bulk Active Transistor, TO-5 3 (Round) Gold Flash Beryllium Copper Through Hole - - Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-87-210-41-117101

114-87-210-41-117101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
114-87-210-41-117101

数据表

114 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP1X15-014B

SIP1X15-014B

SIP1X15-014B-SIP SOCKET 15 CTS

Amphenol ICC (FCI)

0 -
SIP1X15-014B

数据表

SIP1x Bulk Active SIP 15 (1 x 15) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
SIP1X08-014B

SIP1X08-014B

SIP1X08-014B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

0 -
SIP1X08-014B

数据表

SIP1x Bulk Active SIP 8 (1 x 8) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
612-83-306-41-001101

612-83-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
612-83-306-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-306-41-012101

116-87-306-41-012101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-83-308-41-001101

110-83-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
110-83-308-41-001101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP050-1X07-160B

SIP050-1X07-160B

1X07-160B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X07-160B

数据表

SIP050-1x Bulk Active SIP 7 (1 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
BU060Z-178-HT

BU060Z-178-HT

CONN IC DIP SOCKET 6POS GOLD

On Shore Technology Inc.

0 -
BU060Z-178-HT

数据表

BU-178HT Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Copper Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
130-024-000

130-024-000

CONN IC DIP SOCKET 24POS GOLD

3M

0 -
130-024-000

数据表

100 Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 8.00µin (0.203µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Gold Polyphenylene Sulfide (PPS), Glass Filled Flash Brass
04-0518-00

04-0518-00

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0518-00

数据表

518 Bulk Active SIP 4 (1 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
04-0518-11

04-0518-11

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0518-11

数据表

518 Bulk Active SIP 4 (1 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
04-1518-11

04-1518-11

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
05-0518-10T

05-0518-10T

CONN SOCKET SIP 5POS GOLD

Aries Electronics

0 -
05-0518-10T

数据表

518 Bulk Active SIP 5 (1 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
115-87-312-41-001101

115-87-312-41-001101

CONN IC DIP SOCKET 12POS GOLD

Preci-Dip

0 -
115-87-312-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
115-87-310-41-003101

115-87-310-41-003101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
115-87-310-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-83-304-41-002101

116-83-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-83-304-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-308-41-018101

116-87-308-41-018101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
116-87-308-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-306-41-007101

116-87-306-41-007101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
116-87-306-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
04-0518-10T

04-0518-10T

CONN SOCKET SIP 4POS GOLD

Aries Electronics

0 -
04-0518-10T

数据表

518 Bulk Active SIP 4 (1 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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