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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
AR 16 HGL-TT

AR 16 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 16 HGL-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
940-99-068-24-000000

940-99-068-24-000000

CONN SOCKET PLCC 68POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-068-24-000000

数据表

940 Tube Obsolete PLCC 68 (4 x 17) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
612-87-308-41-001101

612-87-308-41-001101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
612-87-308-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DIP316-014B

DIP316-014B

DIP SOCKET 16 CTS

Amphenol ICC (FCI)

0 -
DIP316-014B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
115-87-310-41-001101

115-87-310-41-001101

CONN IC DIP SOCKET 10POS GOLD

Preci-Dip

0 -
115-87-310-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 36-HZL-TT

AR 36-HZL-TT

SOCKET

Assmann WSW Components

0 -
AR 36-HZL-TT

数据表

AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Brass
A-CCS52-Z-SM

A-CCS52-Z-SM

CONN SOCKET PLCC 52POS TIN

Assmann WSW Components

0 -
A-CCS52-Z-SM

数据表

- Bag Obsolete PLCC 52 (4 x 13) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
940-99-028-17-400000

940-99-028-17-400000

CONN SOCKET PLCC 28POS TIN-LEAD

Mill-Max Manufacturing Corp.

0 -
940-99-028-17-400000

数据表

940 Tube Obsolete PLCC 28 (4 x 7) Tin-Lead 100.0µin (2.54µm) Beryllium Copper Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
A14-LCG-T-R

A14-LCG-T-R

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components

0 -
A14-LCG-T-R

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold - - Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled - -
DIP320-011B

DIP320-011B

DIP320-011B-DIP SOCKET 20 CTS

Amphenol ICC (FCI)

0 -
DIP320-011B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
540-88-032-17-400-2

540-88-032-17-400-2

CONN SOCKET PLCC 32POS TIN

Preci-Dip

0 -
540-88-032-17-400-2

数据表

540 Bulk Obsolete PLCC 32 (4 x 8) Tin - Phosphor Bronze Surface Mount Board Guide, Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS) - Phosphor Bronze
AW 127-25/Z-T

AW 127-25/Z-T

SOCKET 25 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-25/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
822475-2

822475-2

CONN SOCKET PLCC 32POS TIN

TE Connectivity AMP Connectors

0 -
822475-2

数据表

- Tape & Reel (TR) Obsolete PLCC 32 (2 x 7, 2 x 9) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Tin Polyphenylene Sulfide (PPS) 150.0µin (3.81µm) Phosphor Bronze
4842-6004-CP

4842-6004-CP

CONN IC DIP SOCKET 42POS TIN

3M

0 -
4842-6004-CP

数据表

4800 Bulk Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 135.0µin (3.43µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 135.0µin (3.43µm) Phosphor Bronze
AR24-HZL-TT

AR24-HZL-TT

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components

0 -
AR24-HZL-TT

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
04-1518-00

04-1518-00

CONN IC DIP SOCKET 4POS GOLD

Aries Electronics

0 -
04-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 4 (2 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
02-0518-11H

02-0518-11H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0518-11H

数据表

518 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
02-1518-11H

02-1518-11H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-1518-11H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
146-83-304-41-035101

146-83-304-41-035101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
146-83-304-41-035101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-83-304-41-036101

146-83-304-41-036101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
146-83-304-41-036101

数据表

146 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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