富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
WMS-140Z

WMS-140Z

CONN IC DIP SOCKET 14POS GOLD

On Shore Technology Inc.

0 -
WMS-140Z

数据表

WMS Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold Flash Beryllium Copper Through Hole Open Frame, Wash Away 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - 200.0µin (5.08µm) Brass
A-CCS20-Z-SM

A-CCS20-Z-SM

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components

0 -
A-CCS20-Z-SM

数据表

- Bag Obsolete PLCC 20 (4 x 5) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
03-0518-10

03-0518-10

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0518-10

数据表

518 Bulk Active SIP 3 (1 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
01-0513-11H

01-0513-11H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0513-11H

数据表

0513 Bulk Active SIP 1 (1 x 1) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - - Solder - - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
03-0518-00

03-0518-00

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0518-00

数据表

518 Bulk Active SIP 3 (1 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
02-0518-11

02-0518-11

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0518-11

数据表

518 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
02-1518-11

02-1518-11

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-1518-11

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
SIP1X10-011B

SIP1X10-011B

SIP1X10-011B-SIP SOCKET 10 CTS

Amphenol ICC (FCI)

0 -
SIP1X10-011B

数据表

SIP1x Bulk Active SIP 10 (1 x 10) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
SIP1X08-001B

SIP1X08-001B

SIP1X08-001B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

0 -
SIP1X08-001B

数据表

SIP1x Bulk Active SIP 8 (1 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
HLS-0101-T-31

HLS-0101-T-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0101-T-31

数据表

HLS Tube Active SIP 1 (1 x 1) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
614-83-304-41-001101

614-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
614-83-304-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-308-41-605101

110-87-308-41-605101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
110-87-308-41-605101

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
4824-3004-CP

4824-3004-CP

CONN IC DIP SOCKET 24POS TIN

3M

0 -
4824-3004-CP

数据表

4800 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
241-08-1-03

241-08-1-03

CONN IC DIP SOCKET 8POS TIN

CNC Tech

0 -
241-08-1-03

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
02-0513-10T

02-0513-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0513-10T

数据表

0513 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
DIP314-011B

DIP314-011B

DIP SOCKET 14 CTS

Amphenol ICC (FCI)

0 -
DIP314-011B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
A20-LCG

A20-LCG

CONN IC DIP SOCKET 20POS GOLD

Assmann WSW Components

0 -
A20-LCG

数据表

- - Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) - Gold - - -
110-83-304-41-105101

110-83-304-41-105101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
110-83-304-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
116-87-304-41-007101

116-87-304-41-007101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-007101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AW 127-19/Z-T

AW 127-19/Z-T

SOCKET 19 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-19/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
共 19086 条记录«上一页1... 8485868788899091...955下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户