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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
AR16-HZL-TT

AR16-HZL-TT

CONN IC DIP SOCKET 16POS TIN

Assmann WSW Components

0 -
AR16-HZL-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
A48-LC-TR

A48-LC-TR

CONN IC DIP SOCKET 48POS TIN

Assmann WSW Components

0 -
A48-LC-TR

数据表

- Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
AW 127-15/Z-T

AW 127-15/Z-T

SOCKET 15 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-15/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
116-87-304-41-003101

116-87-304-41-003101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-003101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-83-304-41-117101

114-83-304-41-117101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
114-83-304-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A 42-LC-TR

A 42-LC-TR

SOCKET

Assmann WSW Components

0 -
A 42-LC-TR

数据表

A Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
114-87-306-41-117101

114-87-306-41-117101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
114-87-306-41-117101

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
114-87-306-41-134161

114-87-306-41-134161

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
114-87-306-41-134161

数据表

114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP1X08-011B

SIP1X08-011B

SIP1X08-011B-SIP SOCKET 8 CTS

Amphenol ICC (FCI)

0 -
SIP1X08-011B

数据表

SIP1x Bulk Active SIP 8 (1 x 8) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
110-83-304-41-005101

110-83-304-41-005101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
110-83-304-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
01-0513-11

01-0513-11

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0513-11

数据表

0513 Bulk Active SIP 1 (1 x 1) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - - Solder - - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
02-1518-00

02-1518-00

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-1518-00

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
115-87-306-41-001101

115-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
115-87-306-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 22-HZL-TT

AR 22-HZL-TT

SOCKET

Assmann WSW Components

0 -
AR 22-HZL-TT

数据表

- Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 196.9µin (5.00µm) Beryllium Copper
AW 127-16/Z-T

AW 127-16/Z-T

SOCKET 16 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-16/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
AR08-HZL/07-TT

AR08-HZL/07-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

0 -
AR08-HZL/07-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
HLS-0101-T-10

HLS-0101-T-10

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0101-T-10

数据表

HLS Tube Active SIP 1 (1 x 1) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
SA1000300000G

SA1000300000G

SA-7.43- 10P ; CLIP:TIN200U" PI

Amphenol Anytek

0 -
SA1000300000G

数据表

SU Bulk Active SIP 10 Tin 200.0µin (5.08µm) Brass Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Beryllium Copper
02-0518-10H

02-0518-10H

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0518-10H

数据表

518 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
02-0518-10T

02-0518-10T

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0518-10T

数据表

518 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
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