富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
AR06-HZL/01-TT

AR06-HZL/01-TT

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components

0 -
AR06-HZL/01-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
AW 127-11/Z-T

AW 127-11/Z-T

SOCKET 11 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-11/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
SIP1X06-011B

SIP1X06-011B

SIP1X06-011B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

0 -
SIP1X06-011B

数据表

SIP1x Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
01-0518-11

01-0518-11

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0518-11

数据表

518 Bulk Active SIP 1 (1 x 1) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
HLS-2001-TT-12

HLS-2001-TT-12

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-2001-TT-12

数据表

HLS Bulk Active SIP 20 (20 x 1) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
01-0518-10H

01-0518-10H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0518-10H

数据表

518 Bulk Active SIP 1 (1 x 1) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
AW 127-12/Z-T

AW 127-12/Z-T

SOCKET 12 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-12/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
1825093-1

1825093-1

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
1825093-1

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 15.0µin (0.38µm) Phosphor Bronze
110-87-306-41-005101

110-87-306-41-005101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
110-87-306-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-87-306-41-605101

110-87-306-41-605101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
110-87-306-41-605101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
614-87-304-41-001101

614-87-304-41-001101

CONN IC DIP SOCKET 321POS GOLD

Preci-Dip

0 -
614-87-304-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 321 (21 x 21) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
DIP308-001B

DIP308-001B

DIP SOCKET 8 CTS

Amphenol ICC (FCI)

0 -
DIP308-001B

数据表

- Bag Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
110-87-304-41-105101

110-87-304-41-105101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
110-87-304-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP050-1X03-160B

SIP050-1X03-160B

1X03-160B-SIP SOCKET 3 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X03-160B

数据表

SIP050-1x Bulk Active SIP 3 (1 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
A14-LCG

A14-LCG

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components

0 -
A14-LCG

数据表

- - Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) - Gold - - -
1-390262-3

1-390262-3

CONN IC DIP SOCKET 32POS TIN

TE Connectivity AMP Connectors

0 -
1-390262-3

数据表

- Tape & Reel (TR) Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - - Phosphor Bronze
612-87-304-41-001101

612-87-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
612-87-304-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 08 HGL-TT

AR 08 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 08 HGL-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
01-0518-10T

01-0518-10T

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0518-10T

数据表

518 Bulk Active SIP 1 (1 x 1) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
110-83-304-41-001101

110-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
110-83-304-41-001101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
共 19086 条记录«上一页1... 8081828384858687...955下一页»
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户