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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
AW 127-13/Z-T

AW 127-13/Z-T

SOCKET 13 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-13/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
SIP1X07-014B

SIP1X07-014B

SIP1X07-014B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

0 -
SIP1X07-014B

数据表

SIP1x Bulk Active SIP 7 (1 x 7) Tin-Lead 150.0µin (3.81µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
SIP1X06-001B

SIP1X06-001B

SIP1X06-001B-SIP SOCKET 6 CTS

Amphenol ICC (FCI)

0 -
SIP1X06-001B

数据表

SIP1x Bulk Active SIP 6 (1 x 6) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
116-87-304-41-006101

116-87-304-41-006101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-006101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
232-20

232-20

CONN SOCKET PLCC 20POS TIN

CNC Tech

0 -
232-20

数据表

- Tube Obsolete PLCC 20 (4 x 5) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
02-1518-10

02-1518-10

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-1518-10

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
SIP41430-001LF

SIP41430-001LF

CONN SOCKET SIP 2POS TIN

Amphenol ICC (FCI)

0 -
SIP41430-001LF

数据表

- Tape & Reel (TR) Obsolete SIP 2 (1 x 2) Tin 200.0µin (5.08µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA), Nylon 200.0µin (5.08µm) Beryllium Copper
A 28-LC/7-T

A 28-LC/7-T

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

0 -
A 28-LC/7-T

数据表

- Box Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) 60.0µin (1.52µm) Phosphor Bronze
232-32

232-32

CONN SOCKET PLCC 32POS TIN

CNC Tech

0 -
232-32

数据表

- Tube Obsolete PLCC 32 (4 x 8) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
AW 127-14/Z-T

AW 127-14/Z-T

SOCKET 14 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-14/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
SIP050-1X04-157B

SIP050-1X04-157B

1X04-157B-SIP SOCKET 4 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X04-157B

数据表

SIP050-1x Bulk Active SIP 4 (1 x 4) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
116-87-304-41-018101

116-87-304-41-018101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-018101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP1X07-011B

SIP1X07-011B

SIP1X07-011B-SIP SOCKET 7 CTS

Amphenol ICC (FCI)

0 -
SIP1X07-011B

数据表

SIP1x Bulk Active SIP 7 (1 x 7) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
115-83-304-41-001101

115-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
115-83-304-41-001101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR06-HZL/07-TT

AR06-HZL/07-TT

CONN IC DIP SOCKET 6POS GOLD

Assmann WSW Components

0 -
AR06-HZL/07-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
232-28

232-28

CONN SOCKET PLCC 28POS TIN

CNC Tech

0 -
232-28

数据表

- Tube Obsolete PLCC 28 (4 x 7) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
A16-LCG

A16-LCG

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

0 -
A16-LCG

数据表

- - Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) - Gold - - -
AR08-HZL/01-TT

AR08-HZL/01-TT

CONN IC DIP SOCKET 8POS GOLD

Assmann WSW Components

0 -
AR08-HZL/01-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
HLS-0101-T-2

HLS-0101-T-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0101-T-2

数据表

HLS Tube Active SIP 1 (1 x 1) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
614-87-304-31-012101

614-87-304-31-012101

CONN IC DIP SOCKET 320POS GOLD

Preci-Dip

0 -
614-87-304-31-012101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 320 (19 x 19) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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