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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
02-1518-10H

02-1518-10H

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-1518-10H

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
02-1518-10T

02-1518-10T

CONN IC DIP SOCKET 2POS GOLD

Aries Electronics

0 -
02-1518-10T

数据表

518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
AR 10 HGL-TT

AR 10 HGL-TT

SOCKET

Assmann WSW Components

0 -
AR 10 HGL-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Gold Polybutylene Terephthalate (PBT), Glass Filled Flash Brass
AR14-HZL-TT

AR14-HZL-TT

CONN IC DIP SOCKET 14POS TIN

Assmann WSW Components

0 -
AR14-HZL-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
232-44

232-44

CONN SOCKET PLCC 44POS TIN

CNC Tech

0 -
232-44

数据表

- Tube Obsolete PLCC 44 (4 x 11) Tin 100.0µin (2.54µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polyphenylene Sulfide (PPS), Glass Filled 100.0µin (2.54µm) Phosphor Bronze
110-87-308-41-005101

110-87-308-41-005101

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

0 -
110-87-308-41-005101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP050-1X04-160B

SIP050-1X04-160B

1X04-160B-SIP SOCKET 4 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X04-160B

数据表

SIP050-1x Bulk Active SIP 4 (1 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
AW 127-17/Z-T

AW 127-17/Z-T

SOCKET 17 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-17/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
AR14-HZL/07-TT

AR14-HZL/07-TT

CONN IC DIP SOCKET 14POS GOLD

Assmann WSW Components

0 -
AR14-HZL/07-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
A22-LC-TT

A22-LC-TT

CONN IC DIP SOCKET 6POS TIN

Assmann WSW Components

0 -
A22-LC-TT

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
115-87-306-41-003101

115-87-306-41-003101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
115-87-306-41-003101

数据表

115 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
1-1825093-1

1-1825093-1

CONN IC DIP SOCKET 6POS GOLD

TE Connectivity AMP Connectors

0 -
1-1825093-1

数据表

Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 30.0µin (0.76µm) Beryllium Copper
01-0513-10H

01-0513-10H

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0513-10H

数据表

0513 Bulk Active SIP 1 (1 x 1) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
02-0513-10

02-0513-10

CONN SOCKET SIP 2POS GOLD

Aries Electronics

0 -
02-0513-10

数据表

0513 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
116-87-304-41-012101

116-87-304-41-012101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-012101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A28-LC-7-TT-R

A28-LC-7-TT-R

CONN IC DIP SOCKET 28POS TIN

Assmann WSW Components

0 -
A28-LC-7-TT-R

数据表

- Box Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) 60.0µin (1.52µm) Phosphor Bronze
HLS-2001-TT-11

HLS-2001-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-2001-TT-11

数据表

HLS Bulk Active SIP 20 (20 x 1) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
4-1814655-7

4-1814655-7

CONN SOCKET SIP 5POS GOLD

TE Connectivity AMP Connectors

0 -
4-1814655-7

数据表

- Bulk Obsolete SIP 5 (1 x 5) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Thermoplastic, Polyester 196.9µin (5.00µm) Brass
AW 127-18/Z-T

AW 127-18/Z-T

SOCKET 18 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-18/Z-T

数据表

- - Active - - - - - - - - - - - - - - -
SIP050-1X05-157B

SIP050-1X05-157B

1X05-157B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

0 -
SIP050-1X05-157B

数据表

SIP050-1x Bulk Active SIP 5 (1 x 5) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 200.0µin (5.08µm) Brass
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