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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
1571994-2

1571994-2

CONN SOCKET SIP 2POS GOLD

TE Connectivity AMP Connectors

0 -
1571994-2

数据表

510 Bulk Obsolete SIP 2 (1 x 2) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Thermoplastic, Polyester 20.0µin (0.51µm) Copper
612-83-304-41-001101

612-83-304-41-001101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
612-83-304-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
SIP1X05-041B

SIP1X05-041B

SIP1X05-041B-SIP SOCKET 5 CTS

Amphenol ICC (FCI)

0 -
SIP1X05-041B

数据表

SIP1x Bulk Active SIP 5 (1 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin-Lead Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
1-390263-5

1-390263-5

CONN IC DIP SOCKET 42POS TIN

TE Connectivity AMP Connectors

0 -
1-390263-5

数据表

- Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - 60.0µin (1.52µm) Phosphor Bronze
1-390262-6

1-390262-6

CONN IC DIP SOCKET 42POS TIN

TE Connectivity AMP Connectors

0 -
1-390262-6

数据表

- Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - 60.0µin (1.52µm) Phosphor Bronze
614-87-306-41-001101

614-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
614-87-306-41-001101

数据表

614 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
AR 22-HZL/7-TT

AR 22-HZL/7-TT

SOCKET

Assmann WSW Components

0 -
AR 22-HZL/7-TT

数据表

AR Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold Flash Brass Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Brass
110-87-306-41-105101

110-87-306-41-105101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
110-87-306-41-105101

数据表

110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS28-Z-SM

A-CCS28-Z-SM

CONN SOCKET PLCC 28POS TIN

Assmann WSW Components

0 -
A-CCS28-Z-SM

数据表

- Bag Obsolete PLCC 28 (4 x 7) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
A18-LCG

A18-LCG

CONN IC DIP SOCKET 18POS GOLD

Assmann WSW Components

0 -
A18-LCG

数据表

- - Obsolete DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold - - Through Hole Open Frame 0.100" (2.54mm) - 0.100" (2.54mm) - Gold - - -
AW 127-20/Z-T

AW 127-20/Z-T

SOCKET 20 CONTACTS SINGLE ROW

Assmann WSW Components

0 -
AW 127-20/Z-T

数据表

- Bulk Active SIP 20 (1 x 20) Gold Flash Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Brass
612-87-306-41-001101

612-87-306-41-001101

CONN IC DIP SOCKET 6POS GOLD

Preci-Dip

0 -
612-87-306-41-001101

数据表

612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
A-CCS32-Z-SM

A-CCS32-Z-SM

CONN SOCKET PLCC 32POS TIN

Assmann WSW Components

0 -
A-CCS32-Z-SM

数据表

- Bag Obsolete PLCC 32 (2 x 7, 2 x 9) Tin 150.0µin (3.81µm) Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
03-0518-10T

03-0518-10T

CONN SOCKET SIP 3POS GOLD

Aries Electronics

0 -
03-0518-10T

数据表

518 Bulk Active SIP 3 (1 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
01-0517-90C

01-0517-90C

CONN SOCKET SIP 1POS GOLD

Aries Electronics

0 -
01-0517-90C

数据表

0517 Bulk Active SIP 1 (1 x 1) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle - - Solder - - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
AR16-HZL/07-TT

AR16-HZL/07-TT

CONN IC DIP SOCKET 16POS GOLD

Assmann WSW Components

0 -
AR16-HZL/07-TT

数据表

- Bag Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester 200.0µin (5.08µm) Beryllium Copper
116-87-304-41-002101

116-87-304-41-002101

CONN IC DIP SOCKET 4POS GOLD

Preci-Dip

0 -
116-87-304-41-002101

数据表

116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
241-06-1-03

241-06-1-03

CONN IC DIP SOCKET 6POS TIN

CNC Tech

0 -
241-06-1-03

数据表

- Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
AR 10-HZL/01-TT

AR 10-HZL/01-TT

CONN IC DIP SOCKET 10POS TIN

Assmann WSW Components

0 -
AR 10-HZL/01-TT

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 200.0µin (5.08µm) Beryllium Copper
A-CCS20-Z

A-CCS20-Z

CONN SOCKET PLCC 20POS TIN

Assmann WSW Components

0 -
A-CCS20-Z

数据表

- Bag Obsolete PLCC 20 (4 x 5) Tin 150.0µin (3.81µm) Phosphor Bronze Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 150.0µin (3.81µm) Phosphor Bronze
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