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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
614-87-084-10-031112

614-87-084-10-031112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

0 -
614-87-084-10-031112

数据表

614 Bulk Active PGA 84 (10 x 10) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
40-6513-11H

40-6513-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
40-6513-11H

数据表

Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
APO-628-T-R

APO-628-T-R

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
APO-628-T-R

数据表

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
APH-0916-T-H

APH-0916-T-H

APH-0916-T-H

Samtec Inc.

0 -
APH-0916-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0516-T-H

APH-0516-T-H

APH-0516-T-H

Samtec Inc.

0 -
APH-0516-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1516-T-H

APH-1516-T-H

APH-1516-T-H

Samtec Inc.

0 -
APH-1516-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0616-T-H

APH-0616-T-H

APH-0616-T-H

Samtec Inc.

0 -
APH-0616-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1116-T-H

APH-1116-T-H

APH-1116-T-H

Samtec Inc.

0 -
APH-1116-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-1316-T-H

APH-1316-T-H

APH-1316-T-H

Samtec Inc.

0 -
APH-1316-T-H

数据表

* - Active - - - - - - - - - - - - - - -
APH-0816-T-H

APH-0816-T-H

APH-0816-T-H

Samtec Inc.

0 -
APH-0816-T-H

数据表

* - Active - - - - - - - - - - - - - - -
110-99-210-41-001000

110-99-210-41-001000

CONN IC DIP SOCKET 10POS TINLEAD

Mill-Max Manufacturing Corp.

0 -
110-99-210-41-001000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-44-210-41-001000

110-44-210-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-44-210-41-001000

数据表

110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
24-6556-10

24-6556-10

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6556-10

数据表

6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Brass
18-820-90C

18-820-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-820-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
18-823-90C

18-823-90C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-823-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
HLS-0317-TT-11

HLS-0317-TT-11

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0317-TT-11

数据表

HLS Tube Active SIP 51 (3 x 17) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
115-41-310-41-001000

115-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-41-310-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-91-310-41-001000

115-91-310-41-001000

SKT IC OPEN LOWPRO

Mill-Max Manufacturing Corp.

0 -
115-91-310-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-0912-T-R

APH-0912-T-R

APH-0912-T-R

Samtec Inc.

0 -
APH-0912-T-R

数据表

* - Active - - - - - - - - - - - - - - -
APH-1412-T-R

APH-1412-T-R

APH-1412-T-R

Samtec Inc.

0 -
APH-1412-T-R

数据表

* - Active - - - - - - - - - - - - - - -
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