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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
APH-0820-T-R

APH-0820-T-R

APH-0820-T-R

Samtec Inc.

0 -
APH-0820-T-R

数据表

* - Active - - - - - - - - - - - - - - -
08-3508-21

08-3508-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3508-21

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
08-3508-31

08-3508-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

0 -
08-3508-31

数据表

508 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
510-83-181-15-051101

510-83-181-15-051101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
510-83-181-15-051101

数据表

510 Bulk Active PGA 181 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
HLS-0210-G-15

HLS-0210-G-15

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0210-G-15

数据表

HLS Tube Active SIP 20 (2 x 10) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
20-7490-10

20-7490-10

SERIES 700 ELEV STRIP LINE

Aries Electronics

0 -
20-7490-10

数据表

700 Elevator Strip-Line™ - Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-71000-10

20-71000-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71000-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-71056-10

20-71056-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71056-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-71070-10

20-71070-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71070-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-711250-10

20-711250-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-711250-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-71219-10

20-71219-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71219-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (2 x 10) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-71250-10

20-71250-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-71250-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7350-10

20-7350-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7350-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7354-10

20-7354-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7354-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7355-10

20-7355-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7355-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7360-10

20-7360-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7360-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7375-10

20-7375-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7375-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7376-10

20-7376-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7376-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7380-10

20-7380-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7380-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
20-7425-10

20-7425-10

CONN SOCKET SIP 20POS TIN

Aries Electronics

0 -
20-7425-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
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