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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
317-91-102-41-005000

317-91-102-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.

0 -
317-91-102-41-005000

数据表

317 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-41-306-41-117000

114-41-306-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-41-306-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
114-91-306-41-117000

114-91-306-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
114-91-306-41-117000

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
17-71140-10

17-71140-10

CONN SOCKET SIP 17POS TIN

Aries Electronics

0 -
17-71140-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
17-71250-10

17-71250-10

CONN SOCKET SIP 17POS TIN

Aries Electronics

0 -
17-71250-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
17-7465-10

17-7465-10

CONN SOCKET SIP 17POS TIN

Aries Electronics

0 -
17-7465-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
17-7490-10

17-7490-10

CONN SOCKET SIP 17POS TIN

Aries Electronics

0 -
17-7490-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
17-7500-10

17-7500-10

CONN SOCKET SIP 17POS TIN

Aries Electronics

0 -
17-7500-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
17-7650-10

17-7650-10

CONN SOCKET SIP 17POS TIN

Aries Electronics

0 -
17-7650-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
17-7750-10

17-7750-10

CONN SOCKET SIP 17POS TIN

Aries Electronics

0 -
17-7750-10

数据表

700 Elevator Strip-Line™ Bulk Active SIP 17 (1 x 17) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
16-810-90WR

16-810-90WR

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-810-90WR

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
115-43-304-61-001000

115-43-304-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
115-43-304-61-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 4 (2 x 2) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
28-3503-30

28-3503-30

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

0 -
28-3503-30

数据表

503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
18-81000-610C

18-81000-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-81000-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-81180-610C

18-81180-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-81180-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-81240-610C

18-81240-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-81240-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-81250-610C

18-81250-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-81250-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8355-610C

18-8355-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8355-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8375-610C

18-8375-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8375-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8400-610C

18-8400-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8400-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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