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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
18-8470-610C

18-8470-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8470-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8500-610C

18-8500-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8500-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8510-610C

18-8510-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8510-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8532-610C

18-8532-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8532-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8540-610C

18-8540-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8540-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8545-610C

18-8545-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8545-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8560-610C

18-8560-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8560-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8590-610C

18-8590-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8590-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8600-610C

18-8600-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8600-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8640-610C

18-8640-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8640-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8650-610C

18-8650-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8650-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8670-610C

18-8670-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8670-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8685-610C

18-8685-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8685-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8700-610C

18-8700-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8700-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8750-610C

18-8750-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8750-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
18-8870-610C

18-8870-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

0 -
18-8870-610C

数据表

8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
HLS-0610-TT-22

HLS-0610-TT-22

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0610-TT-22

数据表

HLS Bulk Active SIP 60 (6 x 10) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Tin Thermoplastic - -
20-0501-21

20-0501-21

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0501-21

数据表

501 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
20-0501-31

20-0501-31

CONN SOCKET SIP 20POS GOLD

Aries Electronics

0 -
20-0501-31

数据表

501 Bulk Active SIP 20 (1 x 20) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
614-87-084-10-001112

614-87-084-10-001112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

0 -
614-87-084-10-001112

数据表

614 Bulk Active PGA 84 (10 x 10) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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