富聪科技订单满¥1000免运费
关注我们:

IC 插座

制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

全部重置
全部应用
结果
图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
15-0501-20

15-0501-20

CONN SOCKET SIP 15POS TIN

Aries Electronics

0 -
15-0501-20

数据表

501 Bulk Active SIP 15 (1 x 15) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
24-6503-20

24-6503-20

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6503-20

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
24-6503-30

24-6503-30

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

0 -
24-6503-30

数据表

503 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
21-0503-20

21-0503-20

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0503-20

数据表

0503 Bulk Active SIP 21 (1 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
21-0503-30

21-0503-30

CONN SOCKET SIP 21POS GOLD

Aries Electronics

0 -
21-0503-30

数据表

0503 Bulk Active SIP 21 (1 x 21) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) - Tin Polyamide (PA), Nylon, Glass Filled 200.0µin (5.08µm) Brass
110-47-306-41-605000

110-47-306-41-605000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-306-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0311-T-31

HLS-0311-T-31

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0311-T-31

数据表

HLS Tube Active SIP 33 (3 x 11) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
116-47-306-41-006000

116-47-306-41-006000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.

0 -
116-47-306-41-006000

数据表

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
APH-1922-T-T

APH-1922-T-T

APH-1922-T-T

Samtec Inc.

0 -
APH-1922-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0522-T-T

APH-0522-T-T

APH-0522-T-T

Samtec Inc.

0 -
APH-0522-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1522-T-T

APH-1522-T-T

APH-1522-T-T

Samtec Inc.

0 -
APH-1522-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0622-T-T

APH-0622-T-T

APH-0622-T-T

Samtec Inc.

0 -
APH-0622-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0222-T-T

APH-0222-T-T

APH-0222-T-T

Samtec Inc.

0 -
APH-0222-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0822-T-T

APH-0822-T-T

APH-0822-T-T

Samtec Inc.

0 -
APH-0822-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1822-T-T

APH-1822-T-T

APH-1822-T-T

Samtec Inc.

0 -
APH-1822-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-1322-T-T

APH-1322-T-T

APH-1322-T-T

Samtec Inc.

0 -
APH-1322-T-T

数据表

* - Active - - - - - - - - - - - - - - -
APH-0422-T-T

APH-0422-T-T

APH-0422-T-T

Samtec Inc.

0 -
APH-0422-T-T

数据表

* - Active - - - - - - - - - - - - - - -
1761505-1

1761505-1

CONN SOCKET PGA ZIF 604POS GOLD

TE Connectivity AMP Connectors

0 -
1761505-1

数据表

- Tray Obsolete PGA, ZIF (ZIP) 604 (25 x 31) Gold 30.0µin (0.76µm) - Surface Mount Open Frame 0.050" (1.27mm) - - - - - - -
22-0501-20

22-0501-20

CONN SOCKET SIP 22POS TIN

Aries Electronics

0 -
22-0501-20

数据表

501 Bulk Active SIP 22 (1 x 22) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Phosphor Bronze
317-47-103-41-005000

317-47-103-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-103-41-005000

数据表

317 Bulk Active SIP 3 (1 x 3) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
富聪科技

搜索

富聪科技

产品

富聪科技

电话

富聪科技

用户