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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
12-6810-90

12-6810-90

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

0 -
12-6810-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
ICO-318-BGG

ICO-318-BGG

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
ICO-318-BGG

数据表

ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyester, Glass Filled 30.0µin (0.76µm) Brass
346-93-142-41-013000

346-93-142-41-013000

CONN SOCKET SIP 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-93-142-41-013000

数据表

346 Bulk Active SIP 42 (1 x 42) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-142-41-013000

346-43-142-41-013000

CONN SOCKET SIP 42POS GOLD

Mill-Max Manufacturing Corp.

0 -
346-43-142-41-013000

数据表

346 Bulk Active SIP 42 (1 x 42) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
16-6810-90

16-6810-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

0 -
16-6810-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
210-11-306-41-001000

210-11-306-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
210-11-306-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
614-87-085-11-041112

614-87-085-11-041112

CONN SOCKET PGA 85POS GOLD

Preci-Dip

0 -
614-87-085-11-041112

数据表

614 Bulk Active PGA 85 (11 x 11) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
317-47-107-41-005000

317-47-107-41-005000

STANDRD SOLDRTL SNG SKT

Mill-Max Manufacturing Corp.

0 -
317-47-107-41-005000

数据表

317 Bulk Active SIP 7 (1 x 7) Gold Flash Beryllium Copper Through Hole - 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-83-201-15-041101

510-83-201-15-041101

CONN SOCKET PGA 201POS GOLD

Preci-Dip

0 -
510-83-201-15-041101

数据表

510 Bulk Active PGA 201 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
146-41-306-41-013000

146-41-306-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-41-306-41-013000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
146-91-306-41-013000

146-91-306-41-013000

CONN SKT DBL

Mill-Max Manufacturing Corp.

0 -
146-91-306-41-013000

数据表

146 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-47-310-41-105000

110-47-310-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

0 -
110-47-310-41-105000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
26-0508-20

26-0508-20

CONN SOCKET SIP 26POS GOLD

Aries Electronics

0 -
26-0508-20

数据表

508 Bulk Active SIP 26 (1 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
26-0508-30

26-0508-30

CONN SOCKET SIP 26POS GOLD

Aries Electronics

0 -
26-0508-30

数据表

508 Bulk Active SIP 26 (1 x 26) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Wire Wrap - -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Brass
16-0501-21

16-0501-21

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0501-21

数据表

501 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
16-0501-31

16-0501-31

CONN SOCKET SIP 16POS GOLD

Aries Electronics

0 -
16-0501-31

数据表

501 Bulk Active SIP 16 (1 x 16) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Phosphor Bronze
HLS-0408-S-2

HLS-0408-S-2

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
HLS-0408-S-2

数据表

HLS Bulk Active SIP 32 (4 x 8) Gold - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
714-43-133-31-018000

714-43-133-31-018000

CONN SOCKET SIP 33POS GOLD

Mill-Max Manufacturing Corp.

0 -
714-43-133-31-018000

数据表

714 Bulk Active SIP 33 (1 x 33) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
110-41-306-41-605000

110-41-306-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-41-306-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-91-306-41-605000

110-91-306-41-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
110-91-306-41-605000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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