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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
251-5949-02-0602

251-5949-02-0602

CONN ZIG-ZAG ZIF 51POS GOLD

3M

13 -
251-5949-02-0602

数据表

Textool™ Bulk Active Zig-Zag, ZIF (ZIP) 51 (1 x 25, 1 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
361-PRS19001-12

361-PRS19001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

16 -
361-PRS19001-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
248-4205-01

248-4205-01

CONN SOCKET QFN 48POS GOLD

3M

14 -
248-4205-01

数据表

Textool™ Bulk Active QFN 48 (4 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.016" (0.40mm) Solder - - Gold Polyethersulfone (PES) - Beryllium Copper
256-4205-01

256-4205-01

CONN SOCKET QFN 56POS GOLD

3M

8 -
256-4205-01

数据表

Textool™ Bulk Active QFN 56 (4 x 14) Gold - Beryllium Copper Through Hole Open Frame 0.016" (0.40mm) Solder 0.016" (0.40mm) - Gold Polyethersulfone (PES) - Beryllium Copper
280-5205-01

280-5205-01

CONN SOCKET QFN 80POS GOLD

3M

10 -
280-5205-01

数据表

Textool™ Bulk Active QFN 80 (4 x 20) Gold - Beryllium Copper Through Hole Open Frame 0.020" (0.50mm) Solder 0.020" (0.50mm) - Gold Polyethersulfone (PES) - Beryllium Copper
44-547-11E

44-547-11E

CONN SOCKET SOIC ZIF 44POS GOLD

Aries Electronics

10 -
44-547-11E

数据表

547 Bulk Active SOIC, ZIF (ZIP) 44 (2 x 22) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Closed Frame - Solder 0.050" (1.27mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 20.0µin (0.51µm) Beryllium Copper
110-47-306-41-001000

110-47-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

373 -
110-47-306-41-001000

数据表

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ED020PLCZ

ED020PLCZ

CONN SOCKET PLCC 20POS TIN

On Shore Technology Inc.

663 -
ED020PLCZ

数据表

ED Tube Active PLCC 20 (4 x 5) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
210-47-308-41-001000

210-47-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

785 -
210-47-308-41-001000

数据表

210 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
EDO-32PLCZSM

EDO-32PLCZSM

CONN SOCKET PLCC 32POS

On Shore Technology Inc.

712 -
EDO-32PLCZSM

数据表

ED Tube Active PLCC 32 (2 x 16) - - Phosphor Bronze Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 105°C - Polyphenylene Sulfide (PPS) - Phosphor Bronze
111-47-306-41-001000

111-47-306-41-001000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.

408 -
111-47-306-41-001000

数据表

111 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-47-308-41-001000

115-47-308-41-001000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.

377 -
115-47-308-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
06-0518-10H

06-0518-10H

CONN SOCKET SIP 6POS GOLD

Aries Electronics

93 -
06-0518-10H

数据表

518 Bulk Active SIP 6 (1 x 6) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
8432-21A1-RK-TP

8432-21A1-RK-TP

CONN SOCKET PLCC 32POS TIN

3M

78 -
8432-21A1-RK-TP

数据表

8400 Tube Active PLCC 32 (2 x 7, 2 x 9) Tin 160.0µin (4.06µm) Copper Alloy Surface Mount Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 160.0µin (4.06µm) Copper Alloy
SA486000

SA486000

CONN IC DIP SOCKET 48POS GOLD

On Shore Technology Inc.

33 -
SA486000

数据表

SA Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Thermoplastic, Polyester, Glass Filled 200.0µin (5.08µm) Brass
115-43-314-41-001000

115-43-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.

38 -
115-43-314-41-001000

数据表

115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-210-41-006000

116-43-210-41-006000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.

78 -
116-43-210-41-006000

数据表

116 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICA-320-STT

ICA-320-STT

CONN IC DIP SKT 20POS

Samtec Inc.

36 -
ICA-320-STT

数据表

ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyester, Glass Filled - Brass
32-6518-10

32-6518-10

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

89 -
32-6518-10

数据表

518 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
ICF-318-T-O

ICF-318-T-O

CONN IC DIP SOCKET 18POS TIN

Samtec Inc.

27 -
ICF-318-T-O

数据表

ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Tin - Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Liquid Crystal Polymer (LCP) - Beryllium Copper
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