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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
48-6554-11

48-6554-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

97 -
48-6554-11

数据表

55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
220-2600-00-0602

220-2600-00-0602

CONN SOCKET SIP ZIF 20POS GOLD

3M

4 -
220-2600-00-0602

数据表

Textool™ Bulk Active SIP, ZIF (ZIP) 20 (1 x 20) Gold - Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
236-6225-00-0602

236-6225-00-0602

CONN SOCKET SIP ZIF 36POS GOLD

3M

6 -
236-6225-00-0602

数据表

Textool™ Bulk Active SIP, ZIF (ZIP) 36 (1 x 36) Gold - Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polysulfone (PSU), Glass Filled 30.0µin (0.76µm) Beryllium Copper
248-5205-01

248-5205-01

CONN SOCKET QFN 48POS GOLD

3M

4 -
248-5205-01

数据表

Textool™ Bulk Active QFN 48 (4 x 12) Gold - Beryllium Copper Through Hole Closed Frame 0.020" (0.50mm) Solder - - Gold Polyethersulfone (PES) - Beryllium Copper
264-5205-01

264-5205-01

CONN SOCKET QFN 64POS GOLD

3M

21 -
264-5205-01

数据表

Textool™ Bulk Active QFN 64 (4 x 16) Gold - Beryllium Copper Through Hole Open Frame 0.020" (0.50mm) Solder 0.020" (0.50mm) - Gold Polyethersulfone (PES) - Beryllium Copper
441-PRS21001-12

441-PRS21001-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

19 -
441-PRS21001-12

数据表

PRS Bulk Active PGA, ZIF (ZIP) - Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -65°C ~ 125°C Tin Polyphenylene Sulfide (PPS) 200.0µin (5.08µm) Beryllium Copper
288-4205-01

288-4205-01

CONN SOCKET QFN 88POS GOLD

3M

11 -
288-4205-01

数据表

Textool™ Bulk Active QFN 88 (4 x 22) Gold - Beryllium Copper Through Hole Open Frame 0.016" (0.40mm) Solder 0.016" (0.40mm) - Gold Polyethersulfone (PES) - Beryllium Copper
ICS-624-T

ICS-624-T

IC SOCKET, DIP, 24P 2.54MM PITCH

Adam Tech

791 -
ICS-624-T

数据表

ICS Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
ED06DT

ED06DT

CONN IC DIP SOCKET 6POS TIN

On Shore Technology Inc.

470 -
ED06DT

数据表

ED Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
ICS-632-T

ICS-632-T

IC SOCKET, DIP, 32P 2.54MM PITCH

Adam Tech

801 -
ICS-632-T

数据表

ICS Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled - Phosphor Bronze
ED32DT

ED32DT

CONN IC DIP SOCKET 32POS TIN

On Shore Technology Inc.

879 -
ED32DT

数据表

ED Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 110°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
ICM-306-1-GT-HT

ICM-306-1-GT-HT

MACHINE PIN SOCKET, IC, DIP, 6P

Adam Tech

770 -
ICM-306-1-GT-HT

数据表

ICM Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold Flash Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polyphenylene Sulfide (PPS) - Beryllium Copper
A 24-LC/7-T

A 24-LC/7-T

CONN IC DIP SOCKET 24POS TIN

Assmann WSW Components

707 -
A 24-LC/7-T

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) 60.0µin (1.52µm) Phosphor Bronze
A 22-LC-T2

A 22-LC-T2

CONN IC DIP SOCKET 22POS TIN

Assmann WSW Components

687 -
A 22-LC-T2

数据表

- Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) 60.0µin (1.52µm) Phosphor Bronze
A 20-LC-TR

A 20-LC-TR

CONN IC DIP SOCKET 20POS TIN

Assmann WSW Components

394 -
A 20-LC-TR

数据表

- Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
A 40-LC-TR

A 40-LC-TR

CONN IC DIP SOCKET 40POS TIN

Assmann WSW Components

143 -
A 40-LC-TR

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
245-32-1-06

245-32-1-06

CONN IC DIP SOCKET 32POS TIN

CNC Tech

873 -
245-32-1-06

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole, Kinked Pin Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin Polybutylene Terephthalate (PBT), Glass Filled 60.0µin (1.52µm) Phosphor Bronze
A 32-LC-TT

A 32-LC-TT

CONN IC DIP SOCKET 32POS TIN

Assmann WSW Components

845 -
A 32-LC-TT

数据表

- Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 85°C Tin Polybutylene Terephthalate (PBT) - Phosphor Bronze
4820-3004-CP

4820-3004-CP

CONN IC DIP SOCKET 20POS TIN

3M

534 -
4820-3004-CP

数据表

4800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin 35.4µin (0.90µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -25°C ~ 85°C Tin Polyester, Glass Filled 35.0µin (0.90µm) Phosphor Bronze
114-87-308-41-134161

114-87-308-41-134161

CONN IC DIP SOCKET 8POS GOLD

Preci-Dip

827 -
114-87-308-41-134161

数据表

114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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