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制造商 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚

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图片 厂商料号 库存情况 价格 数量 数据表 系列 包装 产品状态 类型 位置或引脚数量(网格) 触点表面处理 - 配对 触点表面处理厚度 - 配对部分 触点材料 - 配对部分 安装类型 特性 配对间距 端接方式 引脚间距 工作温度 触点表面处理 - 引脚 外壳材料 触点表面处理厚度 - 引脚 触点材料 - 引脚
299-93-316-10-001000

299-93-316-10-001000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.

78 -
299-93-316-10-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
614-93-632-31-012000

614-93-632-31-012000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

48 -
614-93-632-31-012000

数据表

614 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
ICO-640-SGT

ICO-640-SGT

CONN IC DIP SOCKET 40POS GOLD

Samtec Inc.

52 -
ICO-640-SGT

数据表

ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
110-93-628-41-801000

110-93-628-41-801000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

58 -
110-93-628-41-801000

数据表

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
10-2822-90

10-2822-90

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

29 -
10-2822-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
123-93-632-41-001000

123-93-632-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

66 -
123-93-632-41-001000

数据表

123 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-43-320-11-001000

299-43-320-11-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

99 -
299-43-320-11-001000

数据表

299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
4592

4592

CONN TRANSIST TO-5 8POS TIN

Keystone Electronics

57 -
4592

数据表

- Bulk Active Transistor, TO-5 8 (Round) Tin - Brass Chassis Mount Closed Frame - Solder - - Tin Polyester, Glass Filled - Brass
299-93-320-10-001000

299-93-320-10-001000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.

59 -
299-93-320-10-001000

数据表

299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
16-823-90

16-823-90

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

55 -
16-823-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
08-810-90

08-810-90

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

60 -
08-810-90

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyamide (PA46), Nylon 4/6 10.0µin (0.25µm) Phosphor Bronze
40-C182-10

40-C182-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

68 -
40-C182-10

数据表

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
117-93-656-41-005000

117-93-656-41-005000

CONN IC DIP SOCKET 56POS GOLD

Mill-Max Manufacturing Corp.

69 -
117-93-656-41-005000

数据表

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 56 (2 x 28) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
299-43-618-10-002000

299-43-618-10-002000

CONN IC DIP SOCKET 18POS GOLD

Mill-Max Manufacturing Corp.

41 -
299-43-618-10-002000

数据表

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
TCC03DKSN-S1713

TCC03DKSN-S1713

CONN TRANSIST TO-262 3POS GOLD

Sullins Connector Solutions

10 -
TCC03DKSN-S1713

数据表

- Tray Active Transistor, TO-262 3 (Rectangular) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.150" (3.81mm) Solder 0.150" (3.81mm) -50°C ~ 175°C Gold Polyphenylene Sulfide (PPS) 30.0µin (0.76µm) Beryllium Copper
117-93-764-41-005000

117-93-764-41-005000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

8 -
117-93-764-41-005000

数据表

117 Tube Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
16-810-90C

16-810-90C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

49 -
16-810-90C

数据表

Vertisockets™ 800 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
299-43-628-10-002000

299-43-628-10-002000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.

51 -
299-43-628-10-002000

数据表

299 Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
346-43-164-41-013000

346-43-164-41-013000

CONN SOCKET SIP 64POS GOLD

Mill-Max Manufacturing Corp.

51 -
346-43-164-41-013000

数据表

346 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
18-6810-90T

18-6810-90T

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

41 -
18-6810-90T

数据表

Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6 200.0µin (5.08µm) Phosphor Bronze
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